TP 700 Series thermal pad
TP 700 Series Thermal pads are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.
Product features：Thermal Conductivity：7.0W/mK，High thermal conductivity
Typical applications：Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
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Typical applications：Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
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Product feature■ Thermal Conductivity: 7.0 W/m.k
■ High conformability
■ Electrically insulating
■ Easy to assembly -
Typical applications■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Product Specifications
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | light blue | Visual |
| Thickness（mm） | 0.5~10.0 | astm d374 |
| Density（g/cc） | 3.3 | ASTM D792 |
| Hardness（shore oo） | 50±5 | ASTM D2240 |
| Usage Temperature（℃） | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage（kv/mm） | ＞6.0 | ASTM D149 |
| Dielectric Constant（@10mhz） | 7.1 | ASTM D150 |
| Volume Resistivity（Ω.cm） | 10^12 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal |
|
|
| Thermal conductivity（W/m.K） | 7.0±0.5 | ASTM D5470 |
Purchase information
Standard size: T≤1.5mm，size=200*400mm; T＞1.5mm，size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
Product Performance
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