TP 700 Series thermal pad
TP 700 Series Thermal pads are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.
Product features:Thermal Conductivity:7.0W/mK,High thermal conductivity
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
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Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
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Product feature■ Thermal Conductivity: 7.0 W/m.k
■ High conformability
■ Electrically insulating
■ Easy to assembly -
Typical applications■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Product Specifications
Attribute | Value | Test Method |
---|---|---|
Composition | Ceramic Filler + Silicone | - |
Color | light blue | Visual |
Thickness(mm) | 0.5~6.5 | astm d374 |
Density(g/cc) | 3.3 | ASTM D792 |
Hardness(shore oo) | 50 | ASTM D2240 |
Usage Temperature(℃) | -40~150 | -- |
Electrical | ||
Breakdown Voltage(kv/mm) | >6.0 | ASTM D149 |
Dielectric Constant(@10mhz) | 7.1 | ASTM D150 |
Volume Resistivity(Ω.cm) | 10^12 | ASTM D257 |
Flammability | V-0 | UL94 |
Thermal |
|
|
Thermal conductivity(W/m.K) | 7.0 | ASTM D5470 |
Purchase information
Standard size: T≤1.5mm,size=200*400mm; T>1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
Product Performance

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