TP 700 Series thermal pad
TP 700 Series Thermal pads are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.
Product features：Thermal Conductivity：7.0W/mK，High thermal conductivity
Typical applications：Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
Contact us for samples
Typical applications：Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
-
Product feature■ Thermal Conductivity: 7.0 W/m.k
■ High conformability
■ Electrically insulating
■ Easy to assembly -
Typical applications■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Product Specifications
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | light blue | Visual |
| Thickness（mm） | 0.5~6.5 | astm d374 |
| Density（g/cc） | 3.3 | ASTM D792 |
| Hardness（shore oo） | 50 | ASTM D2240 |
| Usage Temperature（℃） | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage（kv/mm） | ＞6.0 | ASTM D149 |
| Dielectric Constant（@10mhz） | 7.1 | ASTM D150 |
| Volume Resistivity（Ω.cm） | 10^12 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal |
|
|
| Thermal conductivity（W/m.K） | 7.0 | ASTM D5470 |
Purchase information
Standard size: T≤1.5mm，size=200*400mm; T＞1.5mm，size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
Product Performance
Related products
UTP 100 Series thermal pad
UTP 100 is an extremely soft gap filler pad with a fiberglass reinforced liner, on one side .
Learn More
TP 120 Series thermal pad
TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse.
Learn More
TP 150 Series thermal pad
TP150-S is an extremely soft gap filler pad, specifically designed to many design needs.
Learn More
TP 200 Series thermal pad
TP200-S gap filler pad, is key when your thermal needs begin to changed from design enhancement to thermal requirement.
Learn More
TP 300 Series thermal pad
TP 300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics.
Learn More
TP 400 Series thermal pad
TP 400 elevates the thermal performance bar, achieving 4 W/ mK while maintaining a hardness of 55 (shore 00).
Learn More