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HGP6 - Graphene Thermal Pad
The HGP6 series represents the pinnacle of thermal interface materials, engineered with a high-purity graphene matrix. It is designed for the most demanding applications where elite thermal conductivity is critical.
Features: Unmatched Thermal Conductivity；Ultra-Low Thermal Resistance；Exceptional Stability；High Conformability
Applications: HGP6 is the ideal solution for high-performance computing (HPC), advanced automotive electronics, high-power telecommunication equipment, and any scenario where thermal management is a critical factor for performance and reliability.
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Applications: HGP6 is the ideal solution for high-performance computing (HPC), advanced automotive electronics, high-power telecommunication equipment, and any scenario where thermal management is a critical factor for performance and reliability.
Technical Information
Purchase information
Standard Sheet Dimensions: 60×60mm
- Thickness: Customizable within 0.2-2.0mm range
- Processing Options: Edge sealing and adhesive bonding available
- Storage Life: 2 years when stored under specified conditions
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