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HGP6 - Graphene Thermal Pad
The HGP6 series represents the pinnacle of thermal interface materials, engineered with a high-purity graphene matrix. It is designed for the most demanding applications where elite thermal conductivity is critical.
Features: Unmatched Thermal Conductivity；Ultra-Low Thermal Resistance；Exceptional Stability；High Conformability
Applications: HGP6 is the ideal solution for high-performance computing (HPC), advanced automotive electronics, high-power telecommunication equipment, and any scenario where thermal management is a critical factor for performance and reliability.
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Applications: HGP6 is the ideal solution for high-performance computing (HPC), advanced automotive electronics, high-power telecommunication equipment, and any scenario where thermal management is a critical factor for performance and reliability.
Technical Information
| Attribute | Value | Test Method |
|---|---|---|
| Brand | AOK | - |
| Model | HGP6 | - |
| Composition | Graphene | - |
| Color | Dark Gray | Visual |
|
Density (g/cc) |
<0.95 | ASTM D792 |
| Thickness (mm) | 0.2~2.0 | Thickness Gauge |
| Compression Stress (psi@50%) | ≤180 | ASTMD575 |
| Resilience (%) | ≥60 | ASTMD575 |
|
Tensile Strength (MPa) |
≥0.03 | ASTMD412 |
| Usage Temperature（℃） | -40~150 | IEC 60068-2-14 |
| Thermal Performance | ||
| Thermal Resistance（℃.cm2/W@40psi） | ≤0.06 | ASTM D5470 |
Purchase information
Standard Sheet Dimensions: 60×60mm
- Thickness: Customizable within 0.2-2.0mm range
- Processing Options: Edge sealing and adhesive bonding available
- Storage Life: 2 years when stored under specified conditions
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