From thermal pads to gap fillers, AOK delivers a comprehensive range of TIM solutions designed to enhance thermal conductivity and ensure the reliability of your electronic devices.
Thermal pads are ultra-soft and highly compressible and can be die-cut into specified shapes. AOK offers various models with thermal conductivity ranging from 1.0W/m.K to 12.0W/m·K to meet different application needs.
AOK Liquid Gap Filler provides a highly adaptable, self-leveling thermal solution that seamlessly fills irregular gaps and complex geometries. Offering superior thermal conductivity and long-term reliability, it ensures effective heat dissipation in advanced electronic designs.
Thermal grease is used between heat sources such as CPUs and GPUs and heat sinks to reduce thermal resistance. AOK offers a variety of thermal grease models to meet different cooling needs and ensure stable operation of electronic devices.
Thermally conductive potting compound is a two-component thermally conductive potting glue for encapsulation and heat dissipation of electronic components. AOK provides a variety of thermal conductivity options to protect electronic products and extend their service life.
Phase change thermal interface materials undergo a phase change at a specific temperature, better filling contact surfaces and reducing thermal resistance. AOK offers products with various phase transition temperatures and thermal conductivity to improve heat dissipation efficiency.
Best-in-class thermal management material, adhesives, sealants, and coating technologies can support vehicle manufacturers and suppliers in addressing these challenges.
AOK provides high-performance thermal management for 5G infrastructure and networking equipment, maintaining signal stability and system durability under continuous heavy loads.
Founded in 2004, AOK is a high-tech enterprise specializing in the development, production, and sales of thermal conductive and insulation materials. With ISO9001, ISO14001, and IATF16949 certifications, we are committed to providing reliable, high-performance solutions for the electronic vehicles, consumer electronics, and other demanding industries.
Contact us today for a customized thermal solution tailored to your specific needs. AOK is your trusted partner for high-performance thermal interface materials.
In an age where electronic devices are becoming increasingly precise and powerful, heat dissipation has emerged as a critical challenge for R&D engineers. Among the thermal interface materials we ...
With the continuous improvement of electronic device performance, heat dissipation has become a critical challenge. Particularly for high-power, high-density chips that generate substantial heat durin...
Electronic devices are getting smaller and more powerful, making heat dissipation a major challenge. Traditional thermal silicone pads are struggling to keep up with the pace - they have high thermal ...
Jul 09, 2025
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