AOK liquid gap fillers are dispensable thermal interface materials designed to fill variable gaps and uneven surfaces between heat-generating components and heat sinks.
The range includes one-part thermal gel and 1:1 two-part curable gap fillers for manual, semi-automatic and automated dispensing. Thermal conductivity options range from 2.0 to 12.0 W/m·K for automotive electronics, battery packs, telecom equipment, storage modules and power electronics.