Rapid heat dissipation ensures stable device operation.
Provides reliable electrical insulation for enhanced safety.
Soft and easily compressible, conforming perfectly to various surfaces and minimizing thermal resistance.
Available in multiple thicknesses, thermal conductivity levels, and sizes to meet different application needs.
Simple to cut and install, saving time and costs.
Offers good weather resistance and long-term stability.
Customizable solutions available based on customer requirements.
Suitable for various industries including electric vehicles, consumer electronics, and telecommunications.
AOK Technologies offers various thermal conductive pads, such as the high thermal conductivity TP1200 and the ultra-soft UTP100, to meet different needs. Choosing the right thermal pad involves considering key factors:
| Feature | AOK Graphene Thermal Pads | Silicone Thermal Pads |
| Thermal Performance | High thermal conductivity and low thermal resistance; performance depends on grade and assembly conditions. | Multiple conductivity grades for general to high-performance applications |
| Gap & Thickness | Available for thin interfaces; confirm the thickness range of the selected grade. | Better suited to wider gaps and thickness variations |
| Compressibility | Compressible; required contact pressure depends on grade and compression level. | Wide range of hardness and compression options |
| Electrical Insulation | Do not assume electrical insulation; verify the selected grade and any isolation requirements. | Commonly available with electrical insulation |
| Best For | High-power chips and space-constrained designs | EV electronics, power modules, batteries and general gap filling |
Consider AOK graphene thermal pads for high-performance chip interfaces after checking thickness, contact pressure and electrical requirements. Consider silicone thermal pads for gap filling where compliance, thickness options and electrical insulation are required, subject to grade selection.
AOK thermal pads are designed for electronic assemblies that require reliable heat transfer across component gaps while accommodating surface and height variations.
EV Battery & BMS
Gap filling between battery electronics, modules and housings where thermal performance, insulation and controlled compression are important.
Automotive Electronics
Thermal interfaces between heat-generating components and heat sinks or housings in ECUs, ADAS modules and other automotive electronic assemblies. Select the grade to meet the assembly's thermal, electrical and reliability requirements.
5G & Telecom Equipment
Used between processors, RF components, heat sinks and housings to support continuous thermal management.
Power Electronics
Thermal interface solutions for power supplies, inverters, MOSFETs and other heat-generating components.
Consumer Electronics & SSDs
Thin and precisely converted pads for compact assemblies with limited installation space.
LED & Security Equipment
Reliable gap filling for long-operating electronic devices, lighting systems and enclosed equipment.