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HGP10 - Graphene Thermal Pad
AOK HGP10 is our flagship product in the ultra-high thermal conductivity series, born to meet the most rigorous thermal challenges. It utilizes advanced multi-layer graphene orientation technology to achieve unparalleled heat transfer efficiency. Its thermal resistance is as low as ≤0.10°C·cm²/W, enabling rapid heat dissipation from high-power density sources.
Features: Ultra-High Softness and Compliance;Efficient Heat Transfer Capability;Ultra-Low Density Material;Excellent Reliability
Applications: CPU/GPU Packaging;Optical Modules;Telecommunication Base Stations;IGBT Modules
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Applications: CPU/GPU Packaging;Optical Modules;Telecommunication Base Stations;IGBT Modules
Technical Information
| Attribute | Value | Test Method |
|---|---|---|
| Brand | AOK | - |
| Model | HGP10 | - |
| Composition | Graphene | - |
| Color | Dark Gray | Visual |
|
Density (g/cc) |
<0.95 | ASTM D792 |
| Thickness (mm) | 0.2~2.0 | Thickness Gauge |
| Compression Stress (psi@50%) | ≤60 | ASTMD575 |
| Resilience (%) | ≥60 | ASTMD575 |
|
Tensile Strength (MPa) |
≥0.025 | ASTMD412 |
| Usage Temperature（℃） | -40~150 | IEC 60068-2-14 |
| Thermal Performance | ||
| Thermal Resistance（℃.cm2/W@40psi） | ≤0.1 | ASTM D5470 |
Purchase information
Standard Sheet Dimensions: 60×60mm
- Thickness: Customizable within 0.2-2.0mm range
- Processing Options: Edge sealing and adhesive bonding available
- Storage Life: 2 years when stored under specified conditions
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