TP120 Series Thermal Pad

TP120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse. With a shore hardness of 20 (00), and thermal conductivity of 1.2 W/m.K, TP 120 will not overstress applications and provide low contact resistance even in the most varying of applications.
Features: Good thermal conductivity, xtremely soft and cost effective
Applications: Networking and telecommunications. IT: notebooks, tablets, power conversion
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Technical Data



Test Method

Composition Ceramic Filler + Silicone -
Color Light Red Visual
Thickness (mm) 0.5 ~ 12.0 ASTM D374
Density (g/cc) 2.3 ASTM D792
Hardness (Shore OO) 20 ASTM D2240
Usage Temperature (℃) -40 ~ 150 -


Breakdown Voltage (kv/mm) ≥ 6.5 ASTM D149
Dielectric Constant (1MHz) 5.3 ASTM D150

Volume Resistivity (Ω.cm)

1012 ASTM D257
Flammability V-0 UL 94


Thermal Conductivity (W/m.K) 1.2 ISO 22007-2

Legal Disclaimer

The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us representative to determine product availability.

* Thermal Pad Product Reminder

Standard Sheet Size

200x400mm or custom die cut parts.

Thickness available in 0.25mm increments.


Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.