• Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

TP120 Series Thermal Pad

TP120 thermal conductive silicone pad is a special thermal conductive gasket developed for low compression force, low thermal resistance, high softness and compliance applications. It can work stably at -40 ~ +150 ℃ and meet the flame retardant grade requ irements of UL 94 V-0 standards.
Features: good thermal conductivity, xtremely soft and cost effective, RoHS compliant.
Applications: suitable for PC, control board, motor, electronics, CPU, GPU, heat sink, power PCB, PS4/PS5, car machinery, PC body, laptop, solid state drive, gaming equipment, DVD, VCD, case cover, top box, LED IC SMD DIP, cooling module.
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Technical Information

Attribute

Value

Test Method

Composition Ceramic Filler + Silicone -
Color Light Red Visual
Thickness (mm) 0.5 ~ 12.0 ASTM D374
Density (g/cc) 2.3 ASTM D792
Hardness (Shore OO) 20 (Thickness ≤ 1.0 Shore OO 35) ASTM D2240
Usage Temperature (℃) -40 ~ +150 -

Electrical

Breakdown Voltage (kV/mm) ≥ 6.5 ASTM D149
Dielectric Constant @1MHz 5.3 ASTM D150

Volume Resistivity (Ω.cm)

1012 ASTM D257
Flammability V-0 UL 94

Thermal

Thermal Conductivity (W/m.K) 1.2 ISO 22007-2

Legal Disclaimer

The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us or e-mail sales@aok-technologies.com to determine product availability.

* OEM: thermal pads are available in sheets or cut parts to match a wide range of industry standard or customer defined outlines.


Thermal Pad Manufacturer

AOK

Standard Sheet Size

200x400mm or custom die cut parts.

Thickness available in 0.25mm increments.

Storage

Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.

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