TP150 Series Thermal Pad

TP150-S is an extremely soft gap filler pad, specifically designed to many design needs. With a shore hardness of 40 (Shore 00) and thermal conductivity of 1.5 W/m.K, TP150-S provides that added thermal performance that lower thermal pads cannot meet without sacrificing hardness or contact resistance.
Features: Soft and highly compliant, naturally tacky, easing application
Applications: Networking and telecommunications
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Technical Data



Test Method

Composition Ceramic Filler + Silicone -
Color Light Grey Visual
Thickness (mm) 1.0 ~ 10.0 ASTM D374
Density (g/cc) 2.5 ASTM D792
Hardness (shore oo) 40 ASTM D2240
Usage Temperature (℃) -50 ~ 150 -


Breakdown Voltage (Kv/mm) ≥ 7.0 ASTM D149
Dielectric Constant (1MHz) 6.66 ASTM D150
Volume Resistivity (Ω.cm) 1013 ASTM D257
Flammability V-0 UL 94


Thermal Conductivity (W/m.K) 1.5 ISO 22007-2

Legal Disclaimer

The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us representative to determine product availability.

* Thermal Pad Product Reminder

Standard Sheet Size

200x400mm or custom die cut parts.

Thickness available in 0.25mm increments.


Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.