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HGP8 - Graphene Thermal Pad
The HGP8 series is a high-performance thermal pad that offers a superb balance between thermal conductivity, softness, and cost-effectiveness. It is a versatile solution for a wide range of electronic applications.
Features: High Thermal Efficiency;Balanced Properties;Wide Applicability;Long-Term Reliability
Applications: From CPUs and GPUs in personal computers to LED lighting and power conversion modules, HGP8 is a trusted and effective solution for improving thermal management and enhancing device longevity.
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Applications: From CPUs and GPUs in personal computers to LED lighting and power conversion modules, HGP8 is a trusted and effective solution for improving thermal management and enhancing device longevity.
Technical Information
| Attribute | Value | Test Method |
|---|---|---|
| Brand | AOK | - |
| Model | HGP8 | - |
| Composition | Graphene | - |
| Color | Dark Gray | Visual |
|
Density (g/cc) |
<0.95 | ASTM D792 |
| Thickness (mm) | 0.2~2.0 | Thickness Gauge |
| Compression Stress (psi@50%) | ≤100 | ASTMD575 |
| Resilience (%) | ≥60 | ASTMD575 |
|
Tensile Strength (MPa) |
≥0.025 | ASTMD412 |
| Usage Temperature（℃） | -40~150 | IEC 60068-2-14 |
| Thermal Performance | ||
| Thermal Resistance（℃.cm2/W@40psi） | ≤0.08 | ASTM D5470 |
Purchase information
Standard Sheet Dimensions: 60×60mm
- Thickness: Customizable within 0.2-2.0mm range
- Processing Options: Edge sealing and adhesive bonding available
- Storage Life: 2 years when stored under specified conditions
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