TP300 Series Thermal Pad

TP300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics. TP300 can meet the design needs of numerous design requirements and specifications. TP300 will provide the innate thermal requirements your design needs without over stressing the components or cases.
Features: soft and highly compliant, naturally tacky, easing application.
Applications: industrial LEDs, power supplies and conversion, PCB, laptop, chipset, M.2 heat sink, super charge, IPC and medical power supplies, packaged modules, DIN rail power supplies, DC/DC converters and modular DC UPS systems, GaN Chargers.
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Technical Information



Test Method

Composition Ceramic Filler + Silicone -
Color Light Blue Visual
Thickness (mm) 0.5 ~ 10.0 ASTM D374
Density (g/cc) 3.0 ASTM D792
Hardness (shore oo) 55 (Thickness ≥ 1.0 Shore OO 40) ASTM D2240

Usage Temperature (℃)

-40 ~ +150 -


Breakdown Voltage (kV/mm) >5.0 ASTM D149
Dielectric Constant @1MHz 7.3 ASTM D150
Volume Resistivity (Ω.cm) 1013 ASTM D257
Flammability V-0 UL 94


Thermal Conductivity (W/m.K) 3.0 ISO 22007-2

Legal Disclaimer

The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us or e-mail to determine product availability.

* OEM: thermal pads are available in sheets or cut parts to match a wide range of industry standard or customer defined outlines.

Thermal Pad Manufacturer


Standard Sheet Size

200x400mm or custom die cut parts.

Thickness available in 0.25mm increments.


Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.

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