Please accept our cookies to get the best experience of our website.
By clicking “Accept All Cookies”, you agree to the storing of cookies on your device to enhance site navigation, analyze site usage, and assist in our marketing efforts.
-
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
TP300 Series Thermal Pad
TP300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics. TP300 can meet the design needs of numerous design requirements and specifications. TP300 will provide the innate thermal requirements your design needs without over stressing the components or cases.
Features: soft and highly compliant, naturally tacky, easing application.
Applications: industrial LEDs, power supplies and conversion, PCB, laptop, chipset, M.2 heat sink, super charge, IPC and medical power supplies, packaged modules, DIN rail power supplies, DC/DC converters and modular DC UPS systems, GaN Chargers.
Send Inquiry
Applications: industrial LEDs, power supplies and conversion, PCB, laptop, chipset, M.2 heat sink, super charge, IPC and medical power supplies, packaged modules, DIN rail power supplies, DC/DC converters and modular DC UPS systems, GaN Chargers.
Technical Information
Attribute |
Value |
Test Method |
| Composition | Ceramic Filler + Silicone | - |
| Color | Light Blue | Visual |
| Thickness (mm) | 0.5 ~ 10.0 | ASTM D374 |
| Density (g/cc) | 3.0 | ASTM D792 |
| Hardness (shore oo) | 55 (Thickness ≥ 1.0 Shore OO 40) | ASTM D2240 |
|
Usage Temperature (℃) |
-40 ~ +150 | - |
Electrical |
||
| Breakdown Voltage (kV/mm) | ＞5.0 | ASTM D149 |
| Dielectric Constant @1MHz | 7.3 | ASTM D150 |
| Volume Resistivity (Ω.cm) | 1013 | ASTM D257 |
| Flammability | V-0 | UL 94 |
Thermal |
||
| Thermal Conductivity (W/m.K) | 3.0 | ISO 22007-2 |
Legal Disclaimer
The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us or e-mail [email protected] to determine product availability.
* OEM: thermal pads are available in sheets or cut parts to match a wide range of industry standard or customer defined outlines.
Thermal Pad Manufacturer
AOK
Standard Sheet Size
200x400mm or custom die cut parts.
Thickness available in 0.25mm increments.
Storage
Store in a cool, dry, well-ventilated place.
Shelf life
Shelf life of the product is 12 months after date of shipment.
Related Products
HGP6 - Graphene Thermal Pad
The HGP6 series represents the pinnacle of thermal interface materials, engineered with a high-purity graphene matrix. It is designed for the most demanding applications where elite thermal conductivity is critical.
Learn More
HGP8 - Graphene Thermal Pad
The HGP8 series is a high-performance thermal pad that offers a superb balance between thermal conductivity, softness, and cost-effectiveness. It is a versatile solution for a wide range of electronic applications.
Learn More
HGP10 - Graphene Thermal Pad
AOK HGP10 is our flagship product in the ultra-high thermal conductivity series, born to meet the most rigorous thermal challenges. It utilizes advanced multi-layer graphene orientation technology to achieve unparalleled heat transfer efficiency. Its ther
Learn More
UTP100 Series Thermal Pad
UTP100 is an extremely soft gap filler pad with a fiberglass reinforced liner, on one side.
Learn More
TP120 Series Thermal Pad
TP120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse.
Learn More
TP150 Series Thermal Pad
TP150-S is an extremely ultra soft gap filler pad, specifically designed to many design needs.
Learn More
