TP600 Series Thermal Pad
Applications: between electronic components such as semiconductor, IC, CPU, MOS and heat sink, LCD-TV, radio devices and equipment, both analogue and digital, and all the accompanying accessories (GPS receivers, switching units, radio bridges, etc.).
|Composition||Ceramic Filled Silicone||-|
|Thickness (mm)||0.5 ~ 10.0||ASTM D374|
|Density (g/cc)||3.285||ASTM D792|
Hardness (shore oo)
|40 (Thickness ≤ 1.0 Shore OO 50)||ASTM D2240|
|Usage Temperature (℃)||-40 ~ +150||-|
|Breakdown Voltage (kV/mm)||＞5.0||ASTM D149|
|Dielectric Constant @1MHz||7.9||ASTM D150|
|Volume Resistivity (Ω.cm)||1012||ASTM D257|
|Flammability Rating||V-0||UL 94|
|Thermal Conductivity (W/m.K)||6.0||ISO 22007-2|
|Thermal Resistance (℃ −in2/W, @20psi, 1mm )||0.138||ASTM D5470|
The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us or e-mail firstname.lastname@example.org to determine product availability.
* OEM: thermal pads are available in sheets or cut parts to match a wide range of industry standard or customer defined outlines.
Thermal Pad Manufacturer
Standard Sheet Size
200x400mm or custom die cut parts.
Thickness available in 0.25mm increments.
Store in a cool, dry, well-ventilated place.
Shelf life of the product is 12 months after date of shipment.