TP600 Series Thermal Pad

TP600 series thermal pad is a material with high thermal conductivity. It is self-adhesive on both sides. When used with electronic components, it exhibits lower thermal resistance and better electrical insulation characteristics under low compression. It can work stably at -40℃~150℃ and meet the flame retardant requirements of UL94V0.
Features: Thermal conductivity: 6.0W/m.K, high conformability, electrically insulating, easy to assembly
Applications: Between electronic components such as Semiconductor, IC, CPU. MOS and heatsink.
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Technical Data



Test Method

Composition Ceramic Filled Silicone -
Color Warmred Visual
Thickness (mm) 0.5 ~ 10.0 ASTM D374
Density (g/cc) 3.285 ASTM D792

Hardness (shore oo)

60 ASTM D2240
Usage Temperature (℃) -40 ~ 150 -


Breakdown Voltage (kv/mm) >5.0 ASTM D149
Dielectric Constant@1MHz 7.9 ASTM D150
Volume Resistivity (Ω.cm) 1012 ASTM D257
Flammability V-0 UL 94


Thermal Conductivity (W/m.K) 6.0 ISO 22007-2

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The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us representative to determine product availability.

* Thermal Pad Product Reminder

Standard Sheet Size

200x400mm or custom die cut parts.

Thickness available in 0.25mm increments.


Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.