TP700 Series Thermal Pad
Applications: between electronic components such as semiconductor, IC, CPU. MOS and heatsink, power bank fast charger, LED lighting.
|Composition||Ceramic Filler + Silicone||-|
|Thickness (mm)||0.5 ~ 10.0||ASTM D374|
|Density (g/cc)||3.3||ASTM D792|
Hardness (shore oo)
|50 (Thickness ≤ 1.0 Shore OO 55)||ASTM D2240|
|Usage Temperature (℃)||-40 ~ +150||-|
|Breakdown Voltage (kV/mm)||＞6.0||ASTM D149|
|Dielectric Constant @1MHz||7.1||ASTM D150|
|Volume Resistivity (Ω.cm)||1012||ASTM D257|
|Thermal Conductivity (W/m.K)||7.0||ISO 22007-2|
The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us or e-mail email@example.com to determine product availability.
* OEM: thermal pads are available in sheets or cut parts to match a wide range of industry standard or customer defined outlines.
Thermal Pad Manufacturer
Standard Sheet Size
200x400mm or custom die cut parts.
Thickness available in 0.25mm increments.
Store in a cool, dry, well-ventilated place.
Shelf life of the product is 12 months after date of shipment.