TP700 Series Thermal Pad
Applications: Between electronic components such as semiconductor, IC, CPU. MOS and heatsink.
|Composition||Ceramic Filler + Silicone||-|
|Thickness (mm)||0.5 ~ 10.0||ASTM D374|
|Density (g/cc)||3.3||ASTM D792|
Hardness (shore oo)
|Usage Temperature (℃)||-40 ~ 150||-|
|Breakdown Voltage (kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant @1MHz||7.1||ASTM D150|
|Volume Resistivity (Ω.cm)||1012||ASTM D257|
|Thermal Conductivity (W/m.K)||7.0||ISO 22007-2|
The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us representative to determine product availability.
* Thermal Pad Product Reminder
Standard Sheet Size
200x400mm or custom die cut parts.
Thickness available in 0.25mm increments.
Store in a cool, dry, well-ventilated place.
Shelf life of the product is 12 months after date of shipment.