TP700 Series Thermal Pad

TP700 series thermal pads are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.
Features: Thermal conductivity: 7.0W/m.K, high thermal conductivity
Applications: Between electronic components such as semiconductor, IC, CPU. MOS and heatsink.
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Technical Data

Attribute

Value

Test Method

Composition Ceramic Filler + Silicone -
Color Light Blue Visual
Thickness (mm) 0.5 ~ 10.0 ASTM D374
Density (g/cc) 3.3 ASTM D792

Hardness (shore oo)

50 ASTM D2240
Usage Temperature (℃) -40 ~ 150 -

Electrical

Breakdown Voltage (kv/mm) >6.0 ASTM D149
Dielectric Constant @1MHz 7.1 ASTM D150
Volume Resistivity (Ω.cm) 1012 ASTM D257
Flammability V-0 UL 94

Thermal

Thermal Conductivity (W/m.K) 7.0 ISO 22007-2

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The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us representative to determine product availability.

* Thermal Pad Product Reminder


Standard Sheet Size

200x400mm or custom die cut parts.

Thickness available in 0.25mm increments.


Storage

Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.