TP200 Series Thermal Pad
Applications: electro-optical and radar sensors, navigation systems, inertial sensors, GNSS and robotics, speed sensors, displays, embedded computers, power control & conditioning systems, RF & microwave products, networking and telecommunications, notebooks, tablets, power conversion, SSD, NVMe, VAM, VRAM, heat sink, EMS, ITM, MCU.
|Composition||Ceramic Filler + Silicone||-|
|0.7 ~ 12.0||ASTM D374|
|Density (g/cc)||2.82||ASTM D792|
|Hardness (shore oo)||25 (Thickness ≤ 1.0 Shore OO 35)||ASTM D2240|
|Usage Temperature (℃)||-40 ~ +150||-|
|Breakdown Voltage (kV/mm)||≥ 6.0||ASTM D149|
|Dielectric Constant||7.0||ASTM D150|
|Volume Resistivity (Ω.cm)||1013||ASTM D257|
|Thermal Conductivity (W/m.K)||2.0||ISO 22007-2|
The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us or e-mail firstname.lastname@example.org to determine product availability.
* OEM: thermal pads are available in sheets or cut parts to match a wide range of industry standard or customer defined outlines.
Thermal Pad Manufacturer
Standard Sheet Size
200x400mm or custom die cut parts.
Thickness available in 0.25mm increments.
Store in a cool, dry, well-ventilated place.
Shelf life of the product is 12 months after date of shipment.