TP200 Series Thermal Pad

TP200-S gap filler pad, is key when your thermal needs begin to changed from design enhancement to thermal requirement. At 2.0W/m.K, TP200-S begins to add that extra thermal punch many designs require to keep specifications within thermal design targets.
Features: soft and highly compliant, naturally tacky, easing application.
Applications: electro-optical and radar sensors, navigation systems, inertial sensors, GNSS and robotics, speed sensors, displays, embedded computers, power control & conditioning systems, RF & microwave products, networking and telecommunications, notebooks, tablets, power conversion, SSD, NVMe, VAM, VRAM, heat sink, EMS, ITM, MCU.
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Technical Information



Test Method

Composition Ceramic Filler + Silicone -
Color Grey Visual

Thickness (mm)

0.7 ~ 12.0 ASTM D374
Density (g/cc) 2.82 ASTM D792
Hardness (shore oo) 25 (Thickness ≤ 1.0 Shore OO 35) ASTM D2240
Usage Temperature (℃) -40 ~ +150 -


Breakdown Voltage (kV/mm) ≥ 6.0 ASTM D149
Dielectric Constant 7.0 ASTM D150
Volume Resistivity (Ω.cm) 1013 ASTM D257
Flammability V-0 UL 94


Thermal Conductivity (W/m.K) 2.0 ISO 22007-2

Legal Disclaimer

The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us or e-mail to determine product availability.

* OEM: thermal pads are available in sheets or cut parts to match a wide range of industry standard or customer defined outlines.

Thermal Pad Manufacturer


Standard Sheet Size

200x400mm or custom die cut parts.

Thickness available in 0.25mm increments.


Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.

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