TP200 Series Thermal Pad

TP200-S gap filler pad, is key when your thermal needs begin to changed from design enhancement to thermal requirement. At 2.0 W/m.K, TP200-S begins to add that extra thermal punch many designs require to keep specifications within thermal design targets.
Features: Soft and highly compliant, naturally tacky, easing application
Applications: Networking and telecommunications, IT: notebooks, tablets, power conversion
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Technical Data



Test Method

Composition Ceramic Filler + Silicone -
Color Grey Visual

Thickness (mm)

1.0 ~ 12.0 ASTM D374
Density (g/cc) 2.82 ASTM D792
Hardness (shore oo) 25 ASTM D2240
Usage Temperature (℃) -40 ~ 150 -


Breakdown Voltage (Kv/mm) ≥ 6.0 ASTM D149
Dielectric Constant (10MHz) 7.0 ASTM D150
Volume Resistivity (Ω.cm) 1013 ASTM D257
Flammability V-0 UL 94


Thermal Conductivity (W/m.K) 2.0 ISO 22007-2

Legal Disclaimer

The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us representative to determine product availability.

* Thermal Pad Product Reminder

Standard Sheet Size

200x400mm or custom die cut parts.

Thickness available in 0.25mm increments.


Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.