GF Series Thermally Conductive Potting Encapsulant
Applications: electric vehicle (EV) batteries, 5G, autopilot system, mobile phone, AIOT, HPC (high performance computing), server, IC, CPU, MOS, LED, mother board, power supply, microinverter, LCD-TV, notebook, PC, telecom device, battery energy storage system, wireless Hub, DDR ll Module, mechatronic drive systems.
Attribute |
Value |
Test Method |
||||
| - |
GF 100 |
GF 200 |
GF 300 |
GF 400 |
- |
|
|
Composition |
Ceramic Filler + Silicone |
- |
||||
|
Color (A/B) |
White/White |
Pink/White |
White/Blue |
White/Yellow |
Visual |
|
|
Density (g/cc) |
1.83 |
2.5 |
3.0 |
3.1 |
ASTM D792 |
|
| Viscosity (cps) A/B |
Part A:10,000 Part B:10,000 |
Part A: 6,000 Part B: 6,000 |
Part A:11,000 Part B:11,000 |
Part A: 15,000 Part B: 15,000 |
ASTM D2196 | |
| Hardness (Shore OO) | 90 | 65 | 60 | 60 | ASTM D2240 | |
|
Usage Temperature(°C) |
-40 ~ +200 |
-60 ~ +200 |
-60 ~ +200 |
-60 ~ +200 |
- | |
| Flammability | V-0 | V-0 | V-0 | V-0 | UL 94 | |
Electrical |
||||||
|
Breakdown Voltage(kV/mm) |
≥ 10.0 |
≥ 7.0 |
＞7.0 |
＞7.0 |
ASTM D149 |
|
|
Volume Resistivity(Ω.cm) |
1015 |
＞1011 |
1013 |
＞1013 |
ASTM D257 |
|
|
Dielectric Constant @1MHz |
5.5 |
6.0 |
6.7 |
6.7 |
ASTM D150 |
|
Thermal |
||||||
|
Thermal Conductivity(W/m.K) |
0.8 |
2.0 |
3.0 |
3.6 |
ISO 22007-2 | |
Legal Disclaimer
The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us or e-mail sales@aok-technologies.com to determine product availability.
* Product Note
50ml (25ml each part);
400ml (200ml each part);
20kg (10kg each part).
Directions for use
• Working time @25℃ : 30 – 120 min;
• For best results, ensure a 1:1 mix ratio is maintained;
• Full cure @25℃ : 4 hours;
• Full cure @100℃ : 5 minutes.
Storage
Store in a cool, dry, well-ventilated place.
Shelf life
Shelf life of the product is 12 months after date of shipment.
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GF Series Thermally Conductive Potting Encapsulant
