Silicon-Free TP-SF Series Thermal Pad

Certain applications require the cleanliness that only a silicone free gap filler can provide. When need arises, TP SF Series has you covered. With two options TP 200SF and TP 300SF providing 2.0W/m.K and 3.0W/m.K thermal conductivity, TP SF Series has it covered.
Features: Silicone free gap filler pad, 2.0 and 3.0 W/m.K options.
Applications: Silicon sensitive components, fiber optics
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Technical Data

Attribute

Value

Test Method

- TP 200SF TP 300SF -
Composition Acrylate Acrylate -
Color Green Blue Visual
Thickness (mm) 0.5 ~ 3.0 1.0 ~ 10.0 ASTM D374
Density (g/cc) 2.87 3.0 ASTM D792
Hardness (Shore 00) 45 50 ASTM D2240
Usage Temperature (°C) -40 ~ 120 -40 ~ 125 -

Electrical

Breakdown Voltage (Kv/mm) >6.0 ≥ 6.0 ASTM D149
Flammability V-1 V-1 UL 94

Thermal

Thermal Conductivity (W/m.K) 2.0 3.0 ISO 22007-2

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The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us representative to determine product availability.

* Product Reminder


Storage

Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment