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TF Series Thermal Conductive Gap Fillers
TF series thermal conductive gap filler are two-part, 1:1 ratio, ceramic filled silicone dispensable gap fillers. Curing at room temperature lends itself to high volume automation. Typical applications are where high tolerances are present and designs require reduced mechanical stresses.
Features: two-part dispensable gap filler, liquid adhesive, thermally conductive potting compound, improved cost effectiveness with rapid/low temperature cure.
Applications: automotive electronics (ADAS, HEV, NEV, batteries, ECU, EMS, ITM, AC/DC), telecommunications, computer and peripherals, battery energy storage system, between heat-generating semiconductors and a heat sink, mechatronic drive systems, GaN Chargers.
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Applications: automotive electronics (ADAS, HEV, NEV, batteries, ECU, EMS, ITM, AC/DC), telecommunications, computer and peripherals, battery energy storage system, between heat-generating semiconductors and a heat sink, mechatronic drive systems, GaN Chargers.
Technical Information
Attribute |
Value |
Test Method |
|||||
| - | TF 120 |
TF 200 |
TF 300 |
TF 400 |
TF 600 |
- | |
|
Composition |
Ceramic Filler + Silicone | - | |||||
|
Color (A/B) |
White/Light Yellow |
White/Yellow |
White/Light Blue |
Blue/White |
Erythrine/White |
Visual |
|
|
Density (g/cc) |
2.5 |
2.9 |
3.0 |
3.0 |
3.4 |
ASTM D792 |
|
| Viscosity (cps) A/B |
Part A:30,000~60,000 Part B:30,000~60,000 |
Part A:550,000 Part B:550,000 |
Part A:130,000 Part B:130,000 |
Part A:3,800,000 Part B:3,800,000 |
- |
ASTM D2196 |
|
| Hardness (Shore OO) | 45 | 50 | 50 | 50 | 60 |
ASTM D2240 |
|
|
Usage Temperature (℃) |
-40 ~ +200 |
-40 ~ +150 |
-40 ~ +200 |
-40 ~ +150 |
-40 ~ +150 |
- | |
| Flammability | V-0 | V-0 | V-0 | V-0 | V-0 | UL 94 | |
Electrical |
|||||||
|
Breakdown Voltage (kV/mm) |
≥ 7.0 |
≥ 5.0 |
＞7.0 |
＞5.0 |
＞6.0 |
ASTM D149 |
|
|
Dielectric Constant @1MHz |
6.5 |
5.5 |
7.0 |
5.0 |
7.0 |
ASTM D150 |
|
|
Volume Resistivity (Ω.cm) |
1013 |
≥ 1012 |
1013 |
1012 |
1012 |
ASTM D257 |
|
Thermal |
|||||||
|
Thermal Conductivity (W/m.K) |
1.2 |
2.0 |
3.0 |
4.0 |
6.0 |
ISO 22007-2 |
|
Legal Disclaimer
The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us or e-mail sales@aok-technologies.com to determine product availability.
* Product Note
Thermal Gel Manufacturer
AOK
Packing Specification
50ml (25ml each part);
400ml (200ml each part);
20kg (10kg each part).
Directions For Use
• Working hours @25℃ : 1 hour;
• Dry to touch @25℃ : 1 hour;
• Full cure @25℃ : 12 ~ 16 hours;
• Full cure @100℃ : 1 hour.
Storage
25℃, ＜50%RH.
Shelf Life
Shelf life of the product is 6 months after date of shipment.
Additional Documents
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