TF Series Thermal Conductive Gap Fillers

TF series thermal conductive gap filler are two-part, 1:1 ratio, ceramic filled silicone dispensable gap fillers. Curing at room temperature lends itself to high volume automation. Typical applications are where high tolerances are present and designs require reduced mechanical stresses.
Features: Two-part dispensable gap filler, Thermal conductivity: 1.2-4.0 W/m.K
Applications: Networking and Telecommunications
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Technical Data

Attribute

Value

Test Method

- TF 120
TF 200
TF 300
TF 400
-
Composition
Ceramic filler + Silicone
-
Color / Component A
White
Khaki
White
Blue
Visual
Color / Component B
Light Yellow
White
Light Blue
White
Visual
Density (g/cc)
2.5
2.1
3.0
3.0
ASTM D792
Usage Temperature (℃)
- 40 ~ 200
- 40 ~ 200
- 40 ~ 200
- 40 ~ 150
-

Electrical

Breakdown voltage (Kv/mm)
>7.0
7.0
≥ 7.0 ≥ 5.0
ASTM D149
Volume resistivity (Ω.cm)
1013
1012
1013
1012
ASTM D257

Dielectric constant @1MHz

6.5
6.0
7.0 5.0
ASTM D150
Flammability
V-0
V-0
V-0
V-0
UL 94

Thermal

Thermal conductivity (W/m.K)
1.2
2.0
3.0
4.0
ISO 22007-2

Viscosity / Component A (cps)

30000 ~ 60000
280000
130000 - ASTM D2196

Viscosity / Component B (cps)

30000 ~ 60000
280000
130000
-
ASTM D2196

Hardness, after cure (Shore 00)

45
55
50
50
ASTM D2240

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The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us representative to determine product availability.

* Product Reminder


Packing specification

50ml (25ml each part);

400ml (200ml each part);

20kg (10kg each part).

Directions for use

• Working hours @ 25C : 1 hour;

• Dry to touch @ 25C : 1 hour;

• Full cure @ 25C : 12~16 hours;

• Full cure @ 100C : 1 hour.

Storage

Store in a cool, dry, well ventilated place.

Shelf life

Shelf life of the product is 6 months after date of shipment.