TP500 Series Thermal Pad
TP500 thermal conductive silicone pad is a kind of material with high thermal conductivity. It is double-sided selfadhesive. When assembling with electronic components, it shows low thermal resistance and better electrical insulation characteristics under low compression force. It can work stably at -40 ~ +200℃ and meet the flame retardant grade requirements of UL 94 V-0 standards.
Features: elevated performance gap filler pad, thermal conductivity: 5.0W/m.K.
Applications: networking and telecommunications, IT: BGA, ASIC, VRAM, high speed storage, energy storage systems, power box.
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Applications: networking and telecommunications, IT: BGA, ASIC, VRAM, high speed storage, energy storage systems, power box.
Technical Information
Attribute |
Value |
Test Method |
| Composition | Ceramic Filler + Silicone | - |
| Color | Green | Visual |
| Thickness (mm) | 0.5 ~ 6.0 | ASTM D374 |
| Density (g/cc) | 3.2 | ASTM D792 |
|
Hardness (shore oo) |
50 (Thickness ≤ 1.0 Shore OO 60) | ASTM D2240 |
| Usage Temperature (℃) | -40 ~ +200 | - |
Electrical |
||
| Breakdown Voltage (kV/mm) | ≥ 6.0 | ASTM D149 |
| Dielectric Constant @1MHz | 7.4 | ASTM D150 |
| Volume Resistivity (Ω.cm) | 1010 | ASTM D257 |
| Flammability | V-0 | UL 94 |
Thermal |
||
| Thermal Conductivity (W/m.K) | 5.0 | ISO 22007-2 |
Legal Disclaimer
The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us or e-mail sales@aok-technologies.com to determine product availability.
* OEM: thermal pads are available in sheets or cut parts to match a wide range of industry standard or customer defined outlines.
Thermal Pad Manufacturer
AOK
Standard Sheet Size
200x400mm or custom die cut parts.
Thickness available in 0.25mm increments.
Storage
Store in a cool, dry, well-ventilated place.
Shelf life
Shelf life of the product is 12 months after date of shipment.
Additional Documents
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