TP500 Series Thermal Pad

TP500 thermal conductive silicone pad is a kind of material with high thermal conductivity. It's double-sided selfadhesive. When assembling with electronic components, it shows low thermal resistance and better electrical insulation characteristics under low compression force. It can work stably at -40 ~ +200℃ and meet the flame retardant grade requirements of UL 94 V-0 standards.
Features: elevated performance gap filler pad, thermal conductivity: 5.0W/m.K.
Applications: networking and telecommunications, IT: BGA, ASIC, VRAM, high speed storage, energy storage systems, power box.
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Technical Information

Attribute

Value

Test Method

Composition Ceramic Filler + Silicone -
Color Green Visual
Thickness (mm) 0.5 ~ 6.0 ASTM D374
Density (g/cc) 3.2 ASTM D792

Hardness (shore oo)

50 (Thickness ≤ 1.0 Shore OO 60) ASTM D2240
Usage Temperature (℃) -40 ~ +200 -

Electrical

Breakdown Voltage (kV/mm) ≥ 6.0 ASTM D149
Dielectric Constant @1MHz 7.4 ASTM D150
Volume Resistivity (Ω.cm) 1010 ASTM D257
Flammability V-0 UL 94

Thermal

Thermal Conductivity (W/m.K) 5.0 ISO 22007-2

Legal Disclaimer

The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us or e-mail sales@aok-technologies.com to determine product availability.

* OEM: thermal pads are available in sheets or cut parts to match a wide range of industry standard or customer defined outlines.


Thermal Pad Manufacturer

AOK

Standard Sheet Size

200x400mm or custom die cut parts.

Thickness available in 0.25mm increments.

Storage

Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.

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