TP500 Series Thermal Pad

TP500 is a 5W/m.K thermal gap filler, in the TP line of products. With high conductivity combined with a hardness of 50 (shore 00), TP500 is excellent for applications requiring low contact resistance, low pressure vs. deflection, and low thermal resistance. TP500 will provide the overall performance required.
Features: Elevated performance gap filler pad, thermal conductivity: 5.0 W/m.K
Applications: Networking and telecommunications, IT: BGA, ASIC, VRM, high speed storage
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Technical Data



Test Method

Composition Ceramic Filler + Silicone -
Color Green Visual
Thickness (mm) 1.0 ~ 6.0 ASTM D374
Density (g/cc) 3.2 ASTM D792

Hardness (shore oo)

50 ASTM D2240
Usage Temperature (℃) -40 ~ 200 -


Breakdown Voltage (kv/mm) ≥ 6.0 ASTM D149
Dielectric Constant @1MHz 7.4 ASTM D150
Volume Resistivity (Ω.cm) 1010 ASTM D257
Flammability V-0 UL 94


Thermal Conductivity (W/m.K) 5.0 ISO 22007-2

Legal Disclaimer

The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us representative to determine product availability.

* Thermal Pad Product Reminder

Standard Sheet Size

200x400mm or custom die cut parts.

Thickness available in 0.25mm increments.


Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.