TP800 Series Thermal Pad

TP800 thermal conductive silicone pad is a very high thermal conductivity material, the surface consistency is very excellent, can be used to fill small gaps and uneven surfaces, and reliable contact with various shapes and sizes of parts. Low compression force shows lower thermal resistance and better electrical insulation characteristics.
Features: thermal conductivity: 8.0W/m.K, high electrical insulation.
Applications: between electronic components such as semiconductor, IC, CPU. MOS and heat sink, aerial navigation systems.
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Technical Information

Attribute

Value

Test Method

Composition Ceramic Filler + Silicone -
Color Red Visual
Thickness (mm) 0.5 ~ 10.0 ASTM D374
Density (g/cc) 3.35 ASTM D792
Hardness (shore oo) 55 (Thickness ≤ 1.0 Shore OO 60) ASTM D2240
Usage Temperature (℃) -40 ~ +150 -

Electrical

Breakdown Voltage (kV/mm) >6.0 ASTM D149
Dielectric Constant @1MHz 7.2 ASTM D150
Volume Resistivity (Ω.cm) 1012 ASTM D257
Flammability V-0 UL 94

Thermal

Thermal Conductivity (W/m.K) 8.0 ISO 22007-2

Legal Disclaimer

The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us or e-mail sales@aok-technologies.com to determine product availability.

* OEM: thermal pads are available in sheets or cut parts to match a wide range of industry standard or customer defined outlines.


Thermal Pad Manufacturer

AOK

Standard Sheet Size

200x400mm or custom die cut parts.

Thickness available in 0.25mm increments.

Storage

Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.

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