TP800 Series Thermal Pad

TP800 series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Features: Thermal conductivity: 8.0W/m.K, high electrical insulation
Applications: Between electronic components such as semiconductor, IC, CPU. MOS and heatsink
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Technical Data



Test Method

Composition Ceramic Filler + Silicone -
Color Red Visual
Thickness (mm) 0.5 ~ 10.0 ASTM D374
Density (g/cc) 3.35 ASTM D792
Hardness (shore oo) 55 ASTM D2240
Usage Temperature (℃) -40 ~ 150 -


Breakdown Voltage (kv/mm) >6.0 ASTM D149
Dielectric Constant @1MHz 7.2 ASTM D150
Volume Resistivity (Ω.cm) 1012 ASTM D257
Flammability V-0 UL 94


Thermal Conductivity (W/m.K) 8.0 ISO 22007-2

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The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. Please contact us representative to determine product availability.

* Thermal Pad Product Reminder

Standard Sheet Size

200x400mm or custom die cut parts.

Thickness available in 0.25mm increments.


Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.