TP 500 Series thermal pad
TP 500 is a 5W/mK thermal gap filler, in the TP line of products. With high conductivity combined with a hardness of 50 (shore 00), TP 500 is excellent for applications requiring low contact resistance, low pressure vs. deflection, and low thermal resistance. TP 500 will provide the overall performance required.
Product features：Elevated Performance Gap Filler Pad, Thermal conductivity: 5.0 W/m.k
Typical applications：Networking and Telecommunications, IT: BGA, ASIC, VRM, high speed storage
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Typical applications：Networking and Telecommunications, IT: BGA, ASIC, VRM, high speed storage
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Product feature■ Thermal conductivity: 5.0 W/m.k
■ Naturally tacky, easing application
■ Low pressure versus deflection
■ Excellent, high volume applications
■ Elevated Temperature Resistance -
Typical applications■ Networking and Telecommunications
■ IT: BGA, ASIC, VRM, high speed storage
■ Industrial: LEDs, Power Supplies and Conversion
■ Automotive: Control Modules, Turbo Actuators
■Consumer Electronics: Gaming Systems, LCDs, and Graphic Cards
Product Specifications
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Dark green | Visual |
| Thickness（mm） | 1.0~6.0 | ASTM D374 |
| Density（g/cc） | 3.2±0.1 | ASTM D792 |
| Hardness（shore oo） | 50±5 | ASTM D2240 |
| Usage Temperature（℃） | -40~200 | -- |
| Electrical | ||
| Breakdown Voltage（kv/mm） | ≥6.0 | ASTM D149 |
| Dielectric Constant（@10mhz） | 7.4 | ASTM D150 |
| Volume Resistivity（Ω.cm） | 10^10 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal |
|
|
| Thermal conductivity（W/m.K） | 5.0±0.3 | ASTM D5470 |
Purchase information
Standard size: T≤1.5mm，size=200*400mm; T＞1.5mm，size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
Product Performance
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