TP 500 Series thermal pad
TP 500 is a 5W/mK thermal gap filler, in the TP line of products. With high conductivity combined with a hardness of 50 (shore 00), TP 500 is excellent for applications requiring low contact resistance, low pressure vs. deflection, and low thermal resistance. TP 500 will provide the overall performance required.
Product features:Elevated Performance Gap Filler Pad, Thermal conductivity: 5.0 W/m.k
Typical applications:Networking and Telecommunications, IT: BGA, ASIC, VRM, high speed storage
Contact us for samples
Typical applications:Networking and Telecommunications, IT: BGA, ASIC, VRM, high speed storage
-
Product feature■ Thermal conductivity: 5.0 W/m.k
■ Naturally tacky, easing application
■ Low pressure versus deflection
■ Excellent, high volume applications
■ Elevated Temperature Resistance -
Typical applications■ Networking and Telecommunications
■ IT: BGA, ASIC, VRM, high speed storage
■ Industrial: LEDs, Power Supplies and Conversion
■ Automotive: Control Modules, Turbo Actuators
■Consumer Electronics: Gaming Systems, LCDs, and Graphic Cards
Product Specifications
Attribute | Value | Test Method |
---|---|---|
Composition | Ceramic Filler + Silicone | - |
Color | Dark green | Visual |
Thickness(mm) | 0.5~6.5 | ASTM D374 |
Density(g/cc) | 3.2 | ASTM D792 |
Hardness(shore oo) | 50 | ASTM D2240 |
Usage Temperature(℃) | -40~150 | -- |
Electrical | ||
Breakdown Voltage(kv/mm) | ≥6.0 | ASTM D149 |
Dielectric Constant(@10mhz) | 7.4 | ASTM D150 |
Volume Resistivity(Ω.cm) | 10^10 | ASTM D257 |
Flammability | V-0 | UL94 |
Thermal |
|
|
Thermal conductivity(W/m.K) | 5.0 | ASTM D5470 |
Purchase information
Standard size: T≤1.5mm,size=200*400mm; T>1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
Product Performance

Related products

UTP 100 Series thermal pad
UTP 100 is an extremely soft gap filler pad with a fiberglass reinforced liner, on one side .
Learn More

TP 120 Series thermal pad
TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse.
Learn More

TP 150 Series thermal pad
TP150-S is an extremely soft gap filler pad, specifically designed to many design needs.
Learn More

TP 200 Series thermal pad
TP200-S gap filler pad, is key when your thermal needs begin to changed from design enhancement to thermal requirement.
Learn More

TP 300 Series thermal pad
TP 300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics.
Learn More

TP 400 Series thermal pad
TP 400 elevates the thermal performance bar, achieving 4 W/ mK while maintaining a hardness of 55 (shore 00).
Learn More