UTP 100 Series thermal pad
UTP 100 is an extremely soft gap filler pad with a fiberglass reinforced liner, on one side . This combination allows for high breakdown voltage and cut through resistance, while providing the desirable low contact resistance and tolerance pickup of gap filling pads . UTP 100 versatility lends itself to a multitude of designs.
Product features：Thermal Conductivity：1.0W/mK，Ultra Soft, Reinforced Gap Filler Pad
Typical applications：Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
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Typical applications：Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
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Product feature■ Thermal Conductivity：1.0 W/ mK
■ Ultra soft and highly compliant
■ Naturally tacky on one side
■ High cut through resistance
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60% -
Typical applications■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs
Product Specifications
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler, Silicone, and Reinforced Fiberglass | - |
| Color | White and Brick Red | Visual |
| Thickness（mm） | 0.5~10.0 | ASTM D374 |
| Density（g/cc） | 2.0 | ASTM D792 |
| Hardness（shore oo） | 30 | ASTM D2240 |
| Tensile Strength（KN/m） | 2.5 | ASTM D624 |
| Elongation（%） | 60 | ASTM D412 |
| Usage Temperature（℃） | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage（kv/mm） | ≥10.0 | ASTM D149 |
| Dielectric Constant（@10mhz） | 5.7 | ASTM D150 |
| Volume Resistivity（Ω.cm） | 1.0*10^15 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal |
|
|
| Thermal conductivity（W/m.K） | 1.0 | ASTM D5470 |
Purchase information
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
Product Performance
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