Shenzhen AOCHUAN Technology CO., LTD.
Shenzhen AOCHUAN Technology CO., LTD.
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TP Series, Ultra Soft Gap Filler Pads

TP series gap filler pads, is key when your thermal needs begin to changed from design enhancement to thermal requirement. At 2.0 W/m.K, TP series begins to add that extra thermal punch many designs require to keep specifications within thermal design targets.

TP Series, Ultra Soft Gap Filler Pads
Explore More AOK Thermal Interface Materials Videos
Die-cutting process of soft silicone thermal pad
Die-cutting process of soft silicone thermal pad
Silicone pads require natural cooling after high-temperature treatment. Rapid cooling affects conductivity. After cooling, they are custom-cut to specified sizes.
GA200 Thermally Conductive Gel Flow Rate Lab Test
GA200 Thermally Conductive Gel Flow Rate Lab Test
Thermally conductive gel provides efficient, flexible cooling in liquid form. It fits complex spaces, ensures stable performance, and simplifies rework across electronics, automotive, and industrial uses.
How We Product Thermal Interface Material
How We Product Thermal Interface Material
AOK delivers industry-leading thermal solutions to protect and optimize electronics, enhancing performance and reliability through innovative design and precision engineering.
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