Shenzhen AOCHUAN Technology CO., LTD.
Shenzhen AOCHUAN Technology CO., LTD.
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TP Series, Ultra Soft Gap Filler Pads

TP series gap filler pads, is key when your thermal needs begin to changed from design enhancement to thermal requirement. At 2.0 W/m.K, TP series begins to add that extra thermal punch many designs require to keep specifications within thermal design targets.

TP Series, Ultra Soft Gap Filler Pads
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TM series ceramic gap fillers offer precise thermal management, designed for high-tolerance, low-stress applications with flexible manual or automated dispensing.
Having the Right Thermal Management Material
Having the Right Thermal Management Material
Choose the right thermal management materials to effectively handle high-power heat, ensuring your applications perform reliably and maintain peak performance.
GA200 Thermally Conductive Gel Flow Rate Lab Test
GA200 Thermally Conductive Gel Flow Rate Lab Test
Thermally conductive gel provides efficient, flexible cooling in liquid form. It fits complex spaces, ensures stable performance, and simplifies rework across electronics, automotive, and industrial uses.
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