Shenzhen AOCHUAN Technology CO., LTD.
Shenzhen AOCHUAN Technology CO., LTD.
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TP Series, Ultra Soft Gap Filler Pads

TP series gap filler pads, is key when your thermal needs begin to changed from design enhancement to thermal requirement. At 2.0 W/m.K, TP series begins to add that extra thermal punch many designs require to keep specifications within thermal design targets.

TP Series, Ultra Soft Gap Filler Pads
Explore More AOK Thermal Interface Materials Videos
Professional Silicone Thermal Pads Die-cut Processing
Professional Silicone Thermal Pads Die-cut Processing
The AOK TP150 series thermal pad offers superior thermal conductivity and low resistance with exceptional stability, ensuring efficient and reliable cooling in high-demand applications.
Die-cutting process of soft silicone thermal pad
Die-cutting process of soft silicone thermal pad
Silicone pads require natural cooling after high-temperature treatment. Rapid cooling affects conductivity. After cooling, they are custom-cut to specified sizes.
One-Part Dispensable Gap Filler Dispensing Test
One-Part Dispensable Gap Filler Dispensing Test
TM series ceramic gap fillers offer precise thermal management, designed for high-tolerance, low-stress applications with flexible manual or automated dispensing.
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