With the improvement of the CPU running speed, the temperature of the CPU is also increasing, so various cooling devices have appeared on the market. No matter what cooling device is used, it's ne...
When replacing the heat-dissipating silicone grease for the CPU, the most likely problem is that the uneven application of the silicone grease leads to poor heat dissipation, which may cause the CPU t...
The thermally conductive gap filler pad is a thermal conductive material synthesized by a special process with silica gel as the base material, adding some metal oxides and other auxiliary materials. ...
Thermal interface materials (TIMs) is a new type of industrial thermal material, used to dissipate and improve the transfer of heat out of electronics devices. Generally, they are placed between the h...
Lightweight thermal interface materialsReducing weight is a major challenge for EV designers and manufacturers in their quest to reduce power consumption, but also to increase autonomy, which is today...
If you’ve delved into the world of PC building, you've no doubt heard about thermal paste. This material is also known as thermal grease, heat paste, CPU paste, thermal gel, and thermal interface...
The increase in demand for mobile electronic devices has brought about new design challenges in the industry. With an ever-greater emphasis on mechanical strength and thermal management capability, th...
Thermal pads are widely used, such as filling cooling devices, communication hardware, automotive control units, LED lighting equipment, PDP display screen, etc. In these applications, the thermal pad...
When the electronic equipment is working, the components will generate a certain amount of heat, which causes the internal temperature of the equipment to rise rapidly.If the heat is not dissipated in...
We use cookies to optimise and personalise your experience, but you can choose to opt out of non-essential cookies.
To find out more, read our Privacy Policy
+86 755 2976 5899 
English 