We are excited to announce the launch of our latest innovation, the TP1500 Series Thermal Pad. This high-performance thermal interface material is designed to deliver exceptional thermal conductivity,...
Thermal gap filler pads, crucial for thermal management in electronic devices, fill small or large gaps between heat-generating and heat-dissipating surfaces, enhancing heat transfer and preventing ov...
Thermal pads and thermal putty are both used for heat transfer in electronic devices, but they differ in thermal material properties, application methods, and performance.1. Material Composition and S...
Silicone thermal putty is a material used primarily for managing heat in electronic components. It's designed to fill gaps between heat-generating components (like CPUs, GPUs, or other electronic ...
click to view highlightsDate: July 13, 2024Location: Hard Rock Hotel ShenzhenSince it's establishment, AOK Technology has made great achievements in technological innovation and product quality. I...
Our potting solutions for power electronics can indeed propel your business into the future by offering numerous benefits and addressing critical challenges in the industry.Enhanced ProtectionPower el...
No, thermal grease and thermal putty are not the same. While both are used for thermal management and heat transfer purposes, they have different properties and applications.Thermal Grease: Thermal gr...
Thermally conductive greases work by removing insulating air gaps and improving heat dissipation through the use of conductive fillers, optimising the performance and extending the product life. By fo...
Tailored thermal management materials play a crucial role in improving heat dissipation and making it more efficient. In systems where cooling pad and forced convection is available to move heat gener...
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