Thermal gap filler pads, crucial for thermal management in electronic devices, fill small or large gaps between heat-generating and heat-dissipating surfaces, enhancing heat transfer and preventing overheating.

Thermal gap filler pads are often designed to offer both flexibility and vibration dampening. These pads are typically made of soft, compliant materials that can conform to irregular surfaces, ensuring good thermal conductivity while also acting as a cushion to absorb vibrations.

Their flexibility makes them ideal for filling gaps between components that may not be perfectly aligned, while their inherent damping properties help reduce mechanical stress and vibrations in electronic devices and other sensitive equipment.

This dual function is valuable in applications like automotive electronics, consumer devices, and industrial machinery.

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com