No, thermal grease and thermal putty are not the same. While both are used for thermal management and heat transfer purposes, they have different properties and applications.

Thermal Grease: Thermal grease, also known as thermal compound or thermal grease, is a viscous material that contains thermally conductive particles suspended in a silicone or non-silicone-based compound. It's commonly used as an interface material between a heat source (such as a CPU or GPU) and a heat sink or cooling solution. The primary function of thermal grease is to fill microscopic imperfections and air gaps on the surfaces of the heat source and heat sink, improving the thermal contact and conductivity between them. Thermal grease is usually applied as a thin layer and helps to enhance heat transfer efficiency.

Thermal Putty: Thermal putty, on the other hand, is a soft and pliable material that resembles a putty or clay-like substance. It's typically made from a blend of silicone or polymer-based compounds with thermally conductive fillers. Thermal putty is commonly used in applications where conformability and gap-filling capabilities are required. It can be easily shaped and molded to fit irregular surfaces or fill larger gaps between heat-generating components and heat sinks. Thermal putty provides good thermal conductivity and helps to eliminate voids or air pockets that might hinder efficient heat transfer.

In summary, thermal grease is typically used for creating a thin and uniform thermal interface between two surfaces, while thermal putty is more suitable for filling larger gaps and conforming to uneven surfaces. The choice between thermal grease and thermal putty depends on the specific application, the size of gaps to be filled, and the desired thermal conductivity requirements.

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com