TF400 is a high thermal conductivity, two-part, 1:1 ratio, ceramic filled silicone thermally conductive gap fillers. Curing at room temperature lends itself to high volume automation. Typical applications are where high thermal performance is required, where high tolerance are present, and designs requiring reduced mechanical stresses.
• Low thermal resistance
• Low volatility
• Low compression force applications
• Adjustable curing time
• High thermal conductivity gel
• Excellent high and low temperature mechanical and chemical stability
• Automotive Electronics
• Fiber Optic Communication Equipment
• Mechatronic drive systems
• Network communication equipment and modules
• Between heat generating semiconductor and heat sink
• Between battery pack and cold plate
Properties | Attribute | Test Method |
| Color/Component (A/B) | Blue/White | Visual |
| Density (g/cc) | 3.0 | ASTM D792 |
| Extrusion rate (g/min) | 3 ~ 12 | 0.4 MPa 14g needle |
| Operation time (25℃, H） | > 2 | Adjustable to customer needs |
| Hardness (Shore OO) | 50 | ASTM D2240 |
Low-molecular weight silicon content (D3-D10, ppm） | ≤ 40 | - |
| Weight Damnify (%) | ≤ 1.0 | Filter paper adsorption @ 25% compression 125℃ 48H |
| Oil leakage rate (%) | < 1.0 | Filter paper adsorption @ 25% compression 125℃ 48H |
| Continuous use temp (℃) | -40 ~ 150 | - |
| Flame rating | V-0 | UL 94 |
| Shelf life (month) | 6 | Temperature < 40℃ avoid extrusion and exposure to the sun |
Electrical Performance | ||
| Breakdown Voltage (KV/mm) | 5.0 | ASTM D149 |
| Volume Resistance (Ω.cm) | 1012 | ASTM D257 |
| Dielectric Constant | 5.0 | ASTM D150 |
Thermal Performance | ||
| Thermal Conductity (W/m.K) | 4.0 | ISO 22007-2 |
If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com.
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