Thermally conductive gel, available in one-component liquid formable and curable formulations, are thermal interface materials designed to provide low component stress, rework simplicity, process flexibility, in-application stability, and efficient thermal conductivity.
Liquid thermal management materials, gel are designed to help you effectively manage heat in electronic applications, improving device performance and overall reliability. Their liquid form means they are highly conformable, so can be utilized across many different types of assembly.
These heat dissipation gels are effective across industrial and automotive applications, among others.
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