UTP100 is an extremely soft gap filler pad with a fiberglass reinforced liner, on one side.
TP120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse.
TP150-S is an extremely ultra soft gap filler pad, specifically designed to many design needs.
TP200-S gap filler pad, is key when your thermal needs begin to changed from design enhancement to thermal requirement.
TP300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics.
TP400 elevates the thermal performance bar, achieving 4.0W/m.K while maintaining a hardness of 55(shore 00).
TP500 is a 5W/m.K thermal gap filler, in the TP line of products.
TP600 series thermal pad is a material with high thermal conductivity. It is self-adhesive on both sides.
TP700 series thermal pads are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, ...
TP800 series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good.
TP1000 is a 10.0W/m.K, high thermal conductive gap filler pad.
TP1200 is a 12.0W/m.K, high thermal conductive gap filler pad that low thermal resistance and excellent electrical insulation at low compression.
TP1500 is a 15.0W/m.K, high thermal conductive gap filler pad that low thermal resistance and excellent electrical insulation at low compression.
TP150-H40-S thermal conductive silicone gasket is a product that takes into account performance and operability.
TP150-H55-S Thermal Conductive Silicone Gasket is a product that takes into account both performance and operability.
TP200-H25-L is a Low volatility thermally conductive gap filler pad for high electrical insulation ,excellent thermal conductivity and electrical insulation at low compression.
TP200-H35-S is an 2W/(m·K), ultra-soft thermally conductive gap filler pad
TP300-H30-L is a low-volatility thermal conductive gasket, which is made of silica gel and thermal conductive ceramic filler by special process.
TP300-H30-S is an 3.0W/(m.K), ultra-soft thermal conductive gap filler pad with low thermal resistance and high deformation at low pressure.
TP400-H40-9 thermal conductive gap pad is a material with high thermal conductivity
TP400-H50-L is a low volatile thermal conductive gasket, which is made of silica gel and thermal conductive ceramic filler by special process.
TP500-H40-9 is a 5.0W/(m·K), high thermal conductive gap filler pad that low thermal resistance and excellent electrical insulation at low compression. It can work stably at -40℃~150℃ and meet UL94...
TP600-H40-9 is a 6.0W/(m·K), high thermal conductive gap filler pad
TP700 H 50 9 is a material with high thermal conductivity.
TP800-H60-9 is a 8W/m.K, , high thermal conductive gap filler pad that low thermal resistance and excellent electrical insulation at low compression.
TP1000-H65-9 is a 10.0W/(m·K), high thermal conductive gap filler pad that low thermal resistance and excellent electrical insulation at low compression.
TP1200 is a 12.0W/(m·K), high thermal conductive gap filler pad that low thermal resistance and excellent electrical insulation at low compression. It can work stably at -40℃~150℃ and meet UL94 V-0...
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