GF Series Thermally Conductive Potting Encapsulant Application Note

Thermally Conductive Potting Compound

GF series potting glue is a thermal conductive potting glue made of silicone rubber as the base material and filled with thermal conductive ceramic powder. It has excellent electrical insulation performance, can withstand environmental pollution, and avoid damage to products caused by environmental factors such as stress, vibration and humidity. It's especially suitable for products that require good heat dissipation of potting materials.

This product has excellent physical and chemical resistance. After mixing at a ratio of 1:1, it can be cured at room temperature or quickly cured by heating. It has very small shrinkage, no heat release during the curing process, no solvent or curing by-products, and is repairable. It can be deeply cured into an elastomer.

Features and advantages: good thermal conductivity and flame retardancy, low viscosity, good leveling, cured to form a soft rubber-like, good impact resistance, strong adhesion, insulation, moisture resistance, shock resistance, corona resistance, leakage resistance and chemical medium resistance.

Operation Requirements

1. According to the weight, mix and stir evenly at a ratio of A:B = 1:1 before applying the glue. Note: In order to ensure the good performance of the product, before mixing component A and component B in a 1:1 ratio, they need to be fully stirred and then weighed and sampled for proportioning. Then, the prepared glue is stirred evenly, degassed in a vacuum environment (air pressure < -0.95MPa) for 2 ~ 3 minutes, and then glue potting is performed. (If the automatic glue potting equipment is in a vacuum environment during the mixing of AB, there is no need to place it in a vacuum environment for degassed after AB is mixed)

2. After AB is mixed, the product begins to react and cure. The operation time is related to the product formula and is mainly affected by temperature. The curing speed will be accelerated at high temperature, and the operation time will be shortened accordingly. The curing speed will be slow at low temperature, and the operation time will be extended accordingly.

3. The fully mixed and stirred thermal conductive potting glue can be directly poured or poured into the container to be cured. It can be cured at room temperature or heated. If the height of the potting glue is thick and the appearance of the product after potting and curing is required to be high, it can be vacuumed according to the situation to extract the bubbles before potting.

4. Certain materials, chemicals, curing agents and plasticizers will hinder the curing of thermal conductive potting glue (silicone rubber), mainly including: nitrogen and phosphorus compounds, amines, urethanes or amine-containing items, some flux residues. Note: If there is any doubt about whether a certain object or material will hinder curing, it's recommended to conduct a small test to determine its suitability in this application. If there is no non-curing or partial non-curing phenomenon in the experiment, it can be used with confidence.

5. The two components should be stored separately in a sealed manner, and they should be prepared before use. The mixed glue should be used up at one time to avoid waste.

Storage Requirements

● Store in a cool, dry, well-ventilated place;

● Turn the barrel regularly during storage to prevent sedimentation;

● If sedimentation occurs, it needs to be fully stirred before use.

Automated Dispensing

● Usually used in mass production;

● Some products require equipment with preheating function;

● The cycle needs to be opened during downtime to prevent sedimentation in the pipeline and block the feed pipe.

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com

Updated on:2024-10-28 15:38:30
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