TF400 Two-Part Thermally Conductive Gap Fillers

TF Series Thermal Conductive Gap Filler

Introduction

TF400 is a high thermal conductivity, two-part, 1:1 ratio, ceramic filled silicone thermally conductive gap fillers. Curing at room temperature lends itself to high volume automation. Typical applications are where high thermal performance is required, where high tolerance are present, and designs requiring reduced mechanical stresses.

Features

• Low thermal resistance

• Low volatility

• Low compression force applications

• Adjustable curing time

• High thermal conductivity gel

• Excellent high and low temperature mechanical and chemical stability

Applications

• Automotive Electronics

• Fiber Optic Communication Equipment

• Mechatronic drive systems

• Network communication equipment and modules

• Between heat generating semiconductor and heat sink

• Between battery pack and cold plate

Technical Information

Properties

Attribute

Test Method

Color/Component (A/B)
Blue/White
Visual
Density (g/cc)
3.0
ASTM D792
Extrusion rate (g/min)
3 ~ 12
0.4 MPa 14g needle
Operation time (25℃, H)
> 2
Adjustable to customer needs
Hardness (Shore OO)
50
ASTM D2240

Low-molecular weight silicon content (D3-D10, ppm)

≤ 40
-
Weight Damnify (%)
≤ 1.0

Filter paper adsorption @ 25% compression 125℃ 48H

Oil leakage rate (%)
< 1.0

Filter paper adsorption @ 25% compression 125℃ 48H

Continuous use temp (℃)
-40 ~ 150
-
Flame rating
V-0
UL 94
Shelf life (month)
6

Temperature < 40℃ avoid extrusion and exposure to the sun

Electrical Performance

Breakdown Voltage (KV/mm)
5.0
ASTM D149
Volume Resistance (Ω.cm)
1012
ASTM D257
Dielectric Constant
5.0
ASTM D150

Thermal Performance

Thermal Conductity (W/m.K)
4.0
ISO 22007-2

If you would like to learn more about AOK performance thermal materials, please visit our website at www.aok-technologies.com.

Updated on:2023-08-03 16:12:12
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