TP800 thermal conductive silicone pad is a very high thermal conductivity material, the surface consistency is very excellent, can be used to fill small gaps and uneven surfaces, and reliable contact with various shapes and sizes of parts. Low compression force shows lower thermal resistance and better electrical insulation characteristics.
Thermal Conductivity: 8.0W/m.K
High Electrical Insulation
Between electronic components such as semiconductor, IC, CPU. MOS and heat sink, aerial navigation systems.
Properties | Test Method | |
Color | Red | Visual |
Thickness(mm) | 0.5 to 5.0 | ASTM D374 |
Density (g/cc) | 3.35 | ASTM D792 |
Hardness(Shore OO) | 60 | ASTM D2240 |
Weight Damnify (%) | ≤0.7 | Filter paper adsorption @ 25% compression 125℃48H |
Usage Temperature (°C) | - 40 to 150 | − |
Flammability | V-0 | UL 94 |
Electrical | ||
Breakdown Voltage (kV/mm) | ＞6.0 | ASTM D149 |
Volume Resistivity (Ω.cm) | 1012 | ASTM D257 |
Dielectric Constant | 7.2 | ASTM D150 |
Thermal | ||
Thermal Conductivity (W/m-K) | 8.0 | ISO22007-2 |
Thermal resistance (℃.in2/W,[email protected]) | 0.08 | ASTM D5470 |
Attribute | Value | Test Method |
Composition | Ceramic Filler + Silicone | - |
Color | Red | Visual |
Thickness (mm) | 0.5 ~ 10.0 | ASTM D374 |
Density (g/cc) | 3.35 | ASTM D792 |
Hardness (shore oo) | 55 (Thickness ≤ 1.0 Shore OO 60) | ASTM D2240 |
Usage Temperature (℃) | -40 ~ +150 | - |
Electrical | ||
Breakdown Voltage (kV/mm) | ＞6.0 | ASTM D149 |
Dielectric Constant @1MHz | 7.2 | ASTM D150 |
Volume Resistivity (Ω.cm) | 1012 | ASTM D257 |
Flammability | V-0 | UL 94 |
Thermal | ||
Thermal Conductivity (W/m.K) | 8.0 | ISO 22007-2 |
OEM: thermal pads are available in sheets or cut parts to match a wide range of industry standard or customer defined outlines.
AOK
200x400mm or custom die cut parts.
Thickness available in 0.25mm increments.
Store in a cool, dry, well-ventilated place.
Shelf life of the product is 12 months after date of shipment.
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