TP700 H 50 9 is a material with high thermal conductivity. It is double-sided self-adhesive and when used in the assembly of electronic components, it exhibits low thermal resistance and good electrical insulation characteristics under low compression force. It can work stably within the temperature range of -40°C to 150°C and meets the flame retardant grade requirements of UL 94 V-0.
Thermal conductivity: 7.0W/m·K
High thermal conductivity
Ultra-low compression
High electrical insulation
Good temperature resistance
Good toughness and easy to operate
Voltage Regulation Module (VRMs)
ASICs and DSPs
Modules with high thermal conductivity requirements
High-heat BGAs
CD ROM/DVD ROM
Network communication equipment
Attribute | Value | Test Method |
Color | Light blue | Visual |
Thickness(mm) | 0.5~10 | ASTM D374 |
Density(g/cc) | 3.3 | ASTM D792 |
Hardness(Shore 00 ) | 50 | ASTM D2240 |
Weight lost(%) | ≤1.0 | Filter paper adsorption Compression 25% 125 ℃ 48H |
Usage temperature(°C) | -40~150 | / |
Flammability | V-0 | UL 94 |
Shelf Life（Months） | 12 | Temperature < 40 ℃ to avoid extrusion, exposure |
Electrical | ||
Breakdown Voltage (kV/mm) | ＞6.0 | ASTM D149 |
Dielectric constant | 7.1 | ASTM D150 |
Volume Resistivity（Ω.cm） | 1012 | ASTM D257 |
Thermal | ||
Thermal Conductivity(W/m.K) | 7.0 | ISO 22007-2 |
Thermal resistance (℃-in²,[email protected]) | 0.13 | ASTM D5470 |
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