TP600-H60-SF is a silicon-free thermally conductive gap filler pad for high electrical insulation, excellent thermal conductivity and electrical insulation. It can work stably at - 40℃~125℃ and meet UL94 V-0 flame retardant grade.
6.0 W/(m.K)
Silicon-free
High compression
Naturally tacky on both side
High electrical insulation
Easy to assemble and reusable
Fiber Optic Modules
Medical Equipment
Optical precision equipment
Silicone sensitive components
Control Modules
Properties | Attribute | Test Method |
Color | Green | Visual |
Thickness(mm) | 0.5 to 3.0 | ASTM D374 |
Density(g/cc) | 3.3 | ASTM D792 |
Hardness(Shore 00) | 60 | ASTM D2240 |
Weight Loss(%) | ≤1.0 | Filter paper adsorption @25%compression/125℃/48h |
Flammability | V-0 | UL 94 |
Usage Temperature(°C) | - 40 to 125 | / |
Shelf Life(month) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Breakdown voltage (kV/mm) | ≥6.0 | ASTM D149 |
Volume resistivity(Ω.cm) | 1010 | ASTM D257 |
Dielectric Constant | 7.3 | ASTM D150 |
Thermal | ||
Thermal conductivity(W/(m.K)) | 6.0 | ISO 22007-2 |
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