TP500-H70-AM is a gasket with both thermal conductivity and wave absorbing functions. It is made of silica gel and thermally conductive wave absorbing ceramic filler through a special process. It has good thermal conductivity, electromagnetic wave absorption and electromagnetic shielding functions. can absorb the leaked electromagnetic radiation, achieve the purpose of eliminating electromagnetic interference, and provide a good solution for electronic communication products in terms of heat conduction and electromagnetic shielding.
Thermal Conductivity : 5.0 W/(m.K)
Excellent electromagnetic shielding function
Excellent high and low temperature and mechanical properties
High chemical stability
Electronic communication equipment
Digital products, computers
Medical electronic
Automotive electronics
Aerospace and aviation
High-frequency modules
Attribute | Value | Test Method |
Color | Black | Visual |
Thickness (mm) | 1.0 to 10.0 | ASTM D374 |
Density (g/cc) | 4.2 | ASTM D792 |
Hardness (Shore 00) | 70 | ASTM D2240 |
Reflectivity (dB) | -16 @14GHz | GJB2038A-2011 |
Usage Temperature (°C) | -40 to 150 | / |
Flammability | V-0 | UL 94 |
Shelf Life (months) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Volume Resistivity (Ω.cm) | ≥1012 | ASTM D257 |
Thermal | ||
Thermal conductivity (W/(m.K)) | 5.0 | ISO 22007-2 |
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