TP500-H60-SF is a silicon-free thermally conductive gap filler pad for high electrical insulation, excellent thermal conductivity and electrical insulation. It can work stably at - 40℃~125℃ and meet UL94 V-0 flame retardant grade.
5.0 W/(m.K)
No Silicone Oil Exudation or Siloxane Evaporation
Good Mechanical Properties
High compression
Naturally tacky on both sides
High Electrical Insulation
Excellent Durability
Fiber Optic Modules
Medical Equipment
Hard Disk Drives (HDDs)
Optical Precision Equipment
High-end Industrial Control Equipment
Silicone-Sensitive Components/Devices/Products
Automotive Sensors/Control Modules
Properties | Attribute | Test Method |
Color | Blue | Visual |
Thickness (mm) | 0.5 to 3.0 | ASTM D374 |
Density (g/cc) | 3.1 | ASTM D792 |
Hardness (Shore 00) | 60 | ASTM D2240 |
Weight Loss (%) | ≤1.0 | Filter paper adsorption @25%compression/125℃/48h |
Flammability | V-0 | UL 94 |
Usage Temperature (°C) | - 40 to 125 | / |
Shelf Life (month) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Breakdown Voltage (kV/mm) | ≥6.0 | ASTM D149 |
Volume Resistivity (Ω.cm) | 1010 | ASTM D257 |
Dielectric Constant | 5.7 | ASTM D150 |
Thermal | ||
Thermal Conductivity (W/(m.K)) | 5.0 | ISO 22007-2 |
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