TP500-H40-9 is a 5.0W/(m·K), high thermal conductive gap filler pad that low thermal resistance and excellent electrical insulation at low compression. It can work stably at -40℃~150℃ and meet UL94 V-0 flame retardant grade.
5.0W/(m·K)
High electrical insulation
Wide usage temperature
High compression ratio
VRMs
ASICs and DSPs
Network Communication Devices
BGAs
CD ROM/DVD ROM
Properties | Attribute | Test Method |
Color | Green | Visual |
Thickness (mm) | 0.75 to 6.0 | ASTM D374 |
Density (g/cc) | 3.3 | ASTM D792 |
Hardness (Shore 00) | 40 | ASTM D2240 |
Weight Loss (%) | ≤1.0 | Filter paper adsorption @25% compression/125℃/48h |
Flammability | - 40 to 150 | UL 94 |
Usage Temperature (°C) | V-0 | / |
Shelf Life (Month) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Breakdown Voltage (kV/mm) | ≥5.0 | ASTM D149 |
Dielectric Constant (@1MHz) | 7.1 | ASTM D150 |
Volume Resistivity (Ω·cm) | ≥1012 | ASTM D257 |
Thermal | ||
Thermal Conductivity (W/(m·K)) | 5.0 | ISO 22007-2 |
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