TP400-H50-L is a low volatile thermal conductive gasket, which is made of silica gel and thermal conductive ceramic filler by special process. Double-sided self-adhesive , and exhibits well thermal conductivity and electrical insulation performance under low compression force. It can work stably at -40℃~200℃ and meet the flame retardant grade requirements of UL94 V-0.
3.5 W/(m.K) thermal conductivity
Low volatility
Applications at low compression
Naturally adhesive on both side
High electrical insulation
Easy to assemble and reusable
Good temperature resistance
LCD backlight module
Network communication equipment
High-speed large storage drive
Automotive engine control unit
Cooling device to chassis or frame
Flat panel display
Properties | Attribute | Test Method |
Color | White | Visual |
Thickness (mm) | 0.5~6.5 | ASTM D374 |
Density (g/cc) | 3.15 | ASTM D792 |
Hardness (Shore 00) | 50 | ASTM D2240 |
Weight Damnify (% @150℃) | ＜0.2 | ASTM E595-07 |
Low molecular siloxane content D3~D10 (ppm) | ≤50 | / |
Volatile condensate content | No volatile condensate | Glass bottles are baked at 180℃ for 8h for visual inspection |
Usage Temperature (°C) | -40~200 | / |
Flammability | V-0 | UL 94 |
Shelf Life(month) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Breakdown Voltage (kV/mm) | ≥6.0 | ASTM D149 |
Volume Resistivity (Ω.cm) | 1013 | ASTM D257 |
Dielectric Constant (@10MHz) | 7.3 | ASTM D150 |
Thermal | ||
Thermal Conductivity (W/(m.K)) | 3.5 | ISO 22007-02 |
Thermal Resistance (℃.in2/W @20psi,1.0mm) | 0.25 | ASTM D5470 |
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