The TP300-H55-AM1 is a silicone-based pad engineered with wave-absorbing ceramic filler. It provides combined thermal management and EMI shielding by dissipating heat and absorbing electromagnetic radiation, making it an ideal solution for electronic communication devices.
Thermal Conductivity : 3.0 W/(m.K)
Excellent electromagnetic shielding function
Excellent high and low temperature and mechanical properties
High chemical stability
Electronic communication equipment
Digital products, computers
Medical electronic
Automotive electronics
High frequency module
Properties | Attribute | Test Method |
Color | Grey | Visual |
Thickness(mm) | 1.0 to 10.0 | ASTM D374 |
Density(g/cc) | 3.8 | ASTM D792 |
Reflectivity (dB) | <-5 (2~6GHz) | GJB:2038A-2011 |
Hardness(Shore 00) | 55 | ASTM D2240 |
Weight Damnify(%) | ≤1.0 | Filter paper adsorption @25% compression/125℃/48h |
Usage Temperature(°C) | - 40 to 150 | / |
Flammability | V-0 | UL 94 |
Shelf Life(Month) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Volume Resistivity(Ω.cm) | >1012 | ASTM D257 |
Dielectric Constant | ≤12.0 | ASTM D150 @10MHz |
Thermal | ||
Thermal conductivity(W/(m.K)) | 3.0 | ASTM D5470 |
PS: 1. The above shelf life is mainly recommended for customers to use within 12 months. Exceeding the shelf life may cause changes in product release force, affecting assembly and use. The material itself will not deteriorate. If it exceeds the shelf life, as long as the release force and assembly of the product are verified to be correct, it can be
extended indefinitely.
2. The breakdown voltage is measured according to the ASTM D149 test method using manual boosting, but the voltage cannot rise, so the breakdown voltage test value is 0.
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