TP300-H50-SF is a silicone-free thermally conductive gap filler pad for high electrical insulation ,excellent thermal conductivity and electrical insulation. It can work stably at -40℃~125℃ and meet UL94 V-0 flame retardant grade.
3.0 W/(m.K) thermal conductivity
Silicone-free
High compression
Naturally adhesive on both side
High electrical insulation
Easy to assemble and reusable
Fiber Optic Modules
Medical Equipment
Optical precision equipment
Silicone sensitive components
Control Modules
Properties | Attribute | Test Method |
Color | Blue | Visual |
Thickness(mm) | 0.75 to 4.0 | ASTM D374 |
Density(g/cc) | 3.0 | ASTM D792 |
Hardness(Shore 00) | 50 | ASTM D2240 |
Weight Damnify(%) | ≤1.0 | Filter paper adsorption @25% compression,125℃,48h |
Usage Temperature(°C) | - 40 to 125 | / |
Flammability | V-0 | UL 94 |
Shelf Life(month) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Breakdown Voltage(kV/mm) | ≥6.0 | ASTM D149 |
Volume Resistivity(Ω.cm) | 5×1011 | ASTM D257 |
Dielectric Constant | 10.14 | ASTM D150 |
Thermal | ||
Thermal conductivity(W/(m.K)) | 3.0 | ASTM D5470 |
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