TP300-H30-S is an 3.0W/(m.K), ultra-soft thermal conductive gap filler pad with low thermal resistance and high deformation at low pressure. It is recommended to be used on flat surfaces with large structural tolerances. In addition, the product is self-adhesive and requires no additional adhesive that impede thermal conductivity.
3.0W/(m.K)
Self-adhesive on both sides
High electrical insulation
Glass fiber/PI film reinforcement optional
High compression ratio
LCD Backlight Module
Network Communication Devices
High-speed Large Storage Drive
Automotive Engine Control Unit
Properties | Attribute | Test Method |
Color | Light Blue | Visual |
Thickness (mm) | 1.0 to 10.0 | ASTM D374 |
Density (g/cc) | 3.0 | ASTM D792 |
Hardness (Shore 00) | 30 | ASTM D2240 |
Weight Loss (%,Volatilization/Exudation) | ≤0.8 | Filter paper adsorption @25% compression/125℃/48h |
Usage Temperature(°C) | - 40 to 150 | / |
Flammability | V-0 | UL 94 |
Shelf Life(month) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Breakdown Voltage (kV/mm) | ≥6.0 | ASTM D149 |
Volume Resistivity (Ω.cm) | 1013 | ASTM D257 |
Dielectric Constant (@10MHz) | 7.3 | ASTM D150 |
Thermal | ||
Thermal Conductivity (W/(m.K)) | 3.0 | ISO 22007-2 |
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