TP2oo-H45-SF is a silicone-free thermal conductive pad, specially designed and developed for organosilicon sensitive applications as a high thermal conductivity, high strength and flame retardant interface thermal conductive material, which can meet a variety of applications such as high compression, multiple rework, tear resistance, high frequency vibration and impact.
Thermal Conductivity:2.0 W/m·K
No silicone oil precipitation or siloxane volatilization
Well mechanical properties
Weak viscosity, can increase viscosity on one side
High electrical insulation
Optical fiber module
Medical equipment
Hard drive
Optical precision equipment
High-end industrial control equipment
Automotive Sensors/Control Modules
Attribut | Value | Test Method |
Color | Green | Visual |
Thickness (mm) | 1.0 to 4.0 | ASTM D374 |
Density (g/cc) | 2.5 | ASTM D792 |
Hardness (Shore 00) | 45 to 55 | ASTM D2240 |
Weight Loss (%) | ≤1.0 | Filter paper adsorption @25% compression/125℃/48h |
Usage temperature (°C) | -40 to 120 | / |
Flammability | V-0 | UL 94 |
Storage period (Months) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Breakdown Voltage (kV/mm) | ≥6.0 | ASTM D149 |
Dielectric Constant | 7.3 | ASTM D150 |
Volume Resistivity (Ω·cm) | 1.5×1010 to 1011 | ASTM D257 |
Thermal | ||
Thermal Conductivity (W/(m·K)) | 2.0 | ISO 22007-2 |
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