TP200-H25-L is a Low volatility thermally conductive gap filler pad for high electrical insulation ,excellent thermal conductivity and electrical insulation at low compression. It can work stably at -40℃~150℃ and meet UL94 V-0 flame retardant grade.
2.0 W/m.K thermal conductivity
Low volatility
Applications at low compression
Naturally adhesive on both side
High electrical insulation
Easy to assemble and reusable
LCD
Network Communication Devices
High-speed large storage drives
Flat panel displays
Between cooling device to chassis or frame
Vehicle engine control unit
Properties | Attribute | Test Method |
Color | Light Yellow | Visual |
Thickness(mm) | 1.0 to 10 | ASTM D374 |
Density (g/cc) | 2.82 | ASTM D792 |
Hardness(Shore OO) | 25 | ASTM D2240 |
Condensate Content | No volatile condensate | 150℃/ 168H |
Weight Damnify (%，@150℃) | ＜0.1 | ASTM E595-07 |
Low-molecular Silicon Content(ppm,D3~D10) | ≤50 | / |
Flammability | V-0 | UL 94 |
Usage Temperature (°C) | - 40 to 150 | / |
Shelf Life(month) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Breakdown Voltage (kV/mm) | ≥ 6.0 | ASTM D149 |
Volume Resistivity (Ω.cm) | 1013 | ASTM D257 |
Dielectric Constant @1MHz | 5.72 | ASTM D150 |
Thermal | ||
Thermal Conductivity (W/m.K) | 2.0 | ISO 22007-02 |
Thermal Resistance (℃.in2/W,1.0mm,20psi) | 0.2 | ASTM D5470 |
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