TP150-H55-S Ultra-Soft Thermally Conductive Gap Filler Pad

Name: TP150-H55-S Ultra-Soft Thermally Conductive Gap Filler Pad
Brand: Shenzhen AOCHUAN Technology CO., LTD.
Availability: InStock

TP150-H55-S Thermal Conductive Silicone Gasket is a product that takes into account both performance and operability. It is a unique

thermal conductive gasket with low thermal resistance, high flexibility, high wettability, and high compliance, and can work stably at -40°C to 150°C.

Features:

Thermal Conductivity 1.5W/m·k

Super Soft

Double-sided Self-adhesive

High Electrical Insulation

Optional Reinforcement with Fiberglass/PI Film

Low Compression Force Application with High Compression Ratio

Applications:

Flat Panel Display

Power Conversion Equipment

LCD Backlight Module

High-Speed Large-Storage Drive

Automotive Engine Control Unit

Between the Cooling Device and the Chassis or Frame

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Technical Information about TP150-H55-S Ultra-Soft Thermally Conductive Gap Filler Pad

Properties	Attribute	Test Method
Color	Light Gray	visual
Thickness(mm)	0.5~10.0	ASTM D374
Density(g/cc)	2.2	ASTM D792
Hardness(Shore 00)	55~60(d≤1.0mm)	ASTM D2240
Hardness(Shore 00)	50~55(d＞1.0mm)	ASTM D2240
Oil Leakage Rate	≤40 (Φ/mm）	Filter paper adsorption @ 25% compression, 125℃, 48H. The initial diameter is Φ30mm
Oil Leakage Rate	≤0.5（%）
Usage Temperature(°C)	-40~150	/
Fire Resistance Performance	V-0	UL 94
Storage Date	12	Temperature < 40℃. Avoid extrusion and exposure to the sun.
Electrical
Breakdown voltage(kV)@0.3mm	≥10	ASTM D149
Dielectric Constant	4.11	ASTM D150
Volume Resistivity(Ω.cm)	10¹³	ASTM D257
Thermal
Thermal Conductivity Coefficient(W/m · K)	1.5	ISO 22007-2