Shenzhen AOCHUAN Technology CO., LTD.
Shenzhen AOCHUAN Technology CO., LTD.
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TP150-H40-S Ultra-Soft Thermally Conductive Gap Filler Pad

TP150-H40-S Ultra-Soft Thermally Conductive Gap Filler Pad

TP150-H40-S thermal conductive silicone gasket is a product that takes into account performance and operability. It has a unique thermal conductive gasket with low thermal resistance, high softness, high wettability and high compliance. It can work stably at -50℃~150℃.

Features:

Thermal Conductivity : 1.5W/(m.K)

Super soft

Natural adhesive on both sides

High electrical insulation

Glass fiber/PI film reinforcement optional

High compression ratio for low compression force applications


Applications:

LCD backlight module

Flat Panel Displays

Power Conversion Devices

Automotive engine control unit

High speed large storage driver

Between cooling device to chassis or frame


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Technical Information about TP150-H40-S Ultra-Soft Thermally Conductive Gap Filler Pad

Attribute

Value

Test Method

Color

Light grey

Visual

Thickness (mm)

1.0 to 10.0

ASTM D374

Density (g/cc)

2.2

ASTM D792

Hardness (Shore 00)

40

ASTM D2240

Oil Penetration Rate

(Φ/mm)

≤40

Filter paper adsorption

@25% compression/125℃/48h

Initial Φ30mm

(%)

<0.5

Usage Temperature (°C)

-50 to 150

/

Flammability

V-0

UL 94

Shelf Life (months)

12

Temperature<40℃; avoid 

compression, exposure to the sun

Electrical

Breakdown Voltage (kV/mm)

≥7.0

ASTM D149   

Dielectric Constant (@1MHz)

4.11

ASTM D150

Volume Resistivity (Ω.cm)

1013

ASTM D257

Thermal

Thermal Conductivity (W/(m.K))

1.5

ISO 22007-2


Contact AOK
Thermal Management Materials Solution Supplier
sales@aok-technologies.com
[email protected]
+86 755 2976 5899
+86 755 2976 5899
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302 Guihua Road, Guixiang Village, Guanlan Town, Longhua District, Shenzhen City, Guangdong Province, P.R China
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