Shenzhen AOCHUAN Technology CO., LTD.
Shenzhen AOCHUAN Technology CO., LTD.
Email Us
TP1200-H65-9 High Thermally Conductive Gap Filler Pad

TP1200-H65-9 High Thermally Conductive Gap Filler Pad

TP1200 is a 12.0W/(m·K), high thermal conductive gap filler pad that low thermal resistance and excellent electrical insulation at low compression. It can work stably at -40℃~150℃ and meet UL94 V-0 flame retardant grade.

Features:

12.0W/(m·K)

High electrical insulation

Wide usage temperature

High compression ratio


Applications:

VRMs

ASICs and DSPs

Network Communication Devices

BGAs

CD ROM/DVD ROM


Send Inquiry

Technical Information about TP1200-H65-9 High Thermally Conductive Gap Filler Pad

Properties

Attribute

Test Method

Color

Grey

Visual

Thickness(mm)

0.5 to 5.0

ASTM D374

Density(g/cc)

3.3

ASTM D792

Hardness(Shore 00)

65

ASTM D2240

Oil Bleeding(%)

<0.5

Filter paper adsorption

@25%compression,125℃,48H

Usage Temperature(°C)

- 40 to 150

Flammability

V-0

UL 94

Shelf Life(month)

12

Temperature<40℃ avoid extrusion and exposure to the sun

Electrical

Breakdown Voltage(kV/mm)

>5.0

ASTM D149

Volume Resistivity(Ω·cm)

1012

ASTM D257

Dielectric Constant(@1MHz)

7.0

ASTM D150

Thermal

Thermal Conductivity

(W/(m·K))

12.0

ISO22007-2

Thermal Resistance (℃·in2/W @50psi)

T=1.0mm

0.134

ASTM D5470

T=2.0mm

0.167

T=3.0mm

0.345


Contact AOK
Thermal Management Materials Solution Supplier
sales@aok-technologies.com
[email protected]
+86 755 2976 5899
+86 755 2976 5899
Add
302 Guihua Road, Guixiang Village, Guanlan Town, Longhua District, Shenzhen City, Guangdong Province, P.R China
Contact AOK
*
*
*
*
Shenzhen AOCHUAN Technology CO., LTD.
We use cookies to optimise and personalise your experience, but you can choose to opt out of non-essential cookies.
To find out more, read our Privacy Policy
Reject All
Accept All