TP1000-H65-9 is a 10.0W/(m·K), high thermal conductive gap filler pad that low thermal resistance and excellent electrical insulation at low compression. It can work stably at -40℃~150℃ and meet UL94 V-0 flame retardant grade.
10.0W/(m·K)
High electrical insulation
Wide usage temperature
High compression ratio
VRMs
ASICs and DSPs
Network Communication Devices
BGAs
CD ROM/DVD ROM
Properties | Attribute | Test Method |
Color | Grey | Visual |
Thickness(mm) | 0.4 to 5.0 | ASTM D374 |
Density(g/cc) | 3.5 | ASTM D792 |
Hardness(Shore 00) | 65 | ASTM D2240 |
Usage Temperature(°C) | -40 to 150 | / |
Flammability | V-0 | UL 94 |
Shelf Life(months) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Breakdown Voltage(kV/mm) | ＞6.0 | ASTM D149 |
Volume Resistivity(Ω·cm) | 1011 | ASTM D257 |
Dielectric Constant(@1MHz) | 7.0 | ASTM D150 |
Thermal | ||
Thermal Conductivity(W/(m·K)) | 10.0 | ISO22007-2 |
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