TP1000-H60-SF is a Silicon-free Thermal Conductive Pad, which is a high thermal conductivity, high strength, and flame-retardant interface thermal conductive material specially designed and developed for silicone-sensitive applications. It can meet a variety of application scenarios such as high compression, multiple rework, tear resistance, and high-frequency vibration impact.
Thermal conductivity: 10.0 W/(m.K)
No silicone oil precipitation or siloxane volatilization
Good mechanical properties
Weak viscosity
High insulation
Good durability
High compression
Fiber optic module
Medical equipment
Hard disk drive
Optical precision equipment
High-end industrial control equipment
Silicone-sensitive component/ equipment/product
Automotive sensor/control module
Properties | Attribute | Test Method |
Color | Grayish Green | Visual |
Thickness (mm) | 0.5~3.0 | ASTM D374 |
Density (g/cc) | 3.3 | ASTM D792 |
Hardness (Shore 00) | 60 | ASTM D2240 |
Weight Loss (%) | ≤1.0 | Filter paper adsorption @ 25% compression/125℃/48h |
Usage Temperature (°C) | -40~125 | / |
Flammability | V-0 | UL 94 |
Shelf Life (months) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
Breakdown Voltage (kV/mm) | ≥6.0 | ASTM D149 |
Dielectric Constant | 5.8 | ASTM D150 |
Volume Resistivity (Ω.cm) | 1010 | ASTM D257 |
Thermal | ||
Thermal Conductivity (W/(m.K)) | 10.0 | ISO 22007-2 |
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