TM600 is a one-part pre-cured thermal conductive mud. Pre-curing technology is used to maintain long-term reliability and stability, with low installation stress and extremely low thermal resistance. At the same time, it can meet automated production operations and can replace traditional thermal pads or thermal putty.
Thermal Conductivity: 6.0W/(m·K)
Extremely low thermal resistance
Very Low Compression Force
Room temperature store
Network communication equipment
Enclosure
Consumer electronics
Power converter
Power module
Attribute | Value | Test Method | |
Color | Orange | Visual | |
Flow rate | (g/s) | ≥30 | ISO 9048 |
(g/min) | 3 to 4 | 50cc/14 needle @0.42MPa | |
Density (g/cc) | 3.4 | ASTM D792 | |
Cone Penetration (mm) | 170 | GB/T269 | |
Volatile Content (%) | ≤1.0 | 150℃/24h | |
Usage Temperature (°C) | -50 to 150 | / | |
Flammability | V-0 | UL 94 | |
Shelf Life (Months) | 12 | Temperature < 40 ℃ to avoid extrusion, exposure | |
Electrical | |||
Breakdown Voltage (kV/mm) | ≥4.5 | ASTM D149 | |
Thermal | |||
Thermal Conductivity (W/(m·K)) | 6.0 | ISO 22007-2 | |
Thermal Resistance (℃·in2/W @50psi,80℃) | 0.05 | ASTM D5470 | |
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