TM500 is a highly adaptable silicone thermal conductive product featuring low thermal resistance, high thermal conductivity, and excellent electrical insulation. With its strong thixotropy, it can be formulated into a semi-fluid state to meet automated dispensing processes based on customer requirements. It delivers efficient thermal conductivity and outstanding gap-filling performance.
Thermal Conductivity: 5.0W/(m·K)
High electrical insulation
High compression, low stress
Well temperature resistance
Can be automated dispensing
Network Communication Equipment
Storage Module
Consumer Electronics
Power Converter
Power Module
Properties | Attribute | Test Method |
Color | Red | Visual |
Density (g/cc) | 3.3 | ASTM D792 |
Flow Rate (g/min) | 7 to 11 | @14# needle/0.4MPa |
Cone Penetration (mm) | 300 | ASTM D217 |
Usage Temperature (°C) | -40 to 200 | / |
Flammability | V-0 | UL 94 |
Shelf Life (Month) | 12 | Temperature<40℃ avoid extrusion and exposure to the sun |
Electrical | ||
击Volume Resistivity (kV/mm) | ≥5.0 | ASTM D149 |
Volume Resistivity (Ω·cm) | ≥1012 | ASTM D257 |
Thermal | ||
Thermal Conductivity (W/(m·K)) | 5.0 | ISO 22007-2 |
Thermal Resistance (℃·in2/W) | 0.05 | ASTM D5470 |
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