TM400-1 is a one-part pre-cured thermal conductive mud. Pre-curing technology is used to maintain long-term reliability and stability, with low installation stress and extremely low thermal resistance. At the same time, it can meet automated production operations and can replace traditional thermal pads or thermal putty.
Thermal Conductivity：4.2W/m.k
No later re-curing is required for pre-curing
Very low interfacial thermal resistance
Low installation stress
Storage at room temperature
Consumer and portable mobile devices
PC and Server
OBC and other in-vehicle applications
Power supply and UPS
Power device
Attribute | Value | Test Method |
Color | Blue | Visual |
Density(g/cc) | 3.4 | ASTM D792 |
Extrusion rate（g/min） | 1~2 | 30cc管，0.4MP14g针嘴 |
Usage temperature(°C) | -40~200 | / |
Flammability | V-0 | UL 94 |
Shelf Life（Month） | 6 | Temperature < 40 ℃ to avoid extrusion, exposure |
Thermal | ||
Thermal Conductivity(W/m-K) | 4.2 | ISO 22007-2 |
Thermal resistance （℃∗in2/W @50psi） | ＜0.05 | ASTM D5470 |
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